Infrared Light Emitting Diodes
LN66
GaAs Infrared Light Emitting Diode
Unit : mm
For optical control systems
Features
High-power output, high-efficiency : P
O
= 8 mW (typ.)
Emitted light spectrum suited for silicon photodetectors
Wide directivity :
θ
= 25 deg. (typ.)
Transparent epoxy resin package
7.65±0.2
ø5.0±0.2
Not soldered
2-1.0±0.15
2-0.6±0.15
2.54
0.6±0.15
2
1
Absolute Maximum Ratings
(Ta = 25˚C)
Parameter
Symbol
P
D
I
F
Power dissipation
Forward current (DC)
Pulse forward current
Reverse voltage (DC)
Storage temperature
I
FP*
V
R
Operating ambient temperature
T
opr
T
stg
*
f = 100 Hz, Duty cycle = 0.1 %
Parameter
isc
on
Electro-Optical Characteristics
(Ta = 25˚C)
Symbol
P
O*
λ
P
∆λ
V
F
I
R
C
t
θ
Spectral half band width
Forward voltage (DC)
Reverse current (DC)
Half-power angle
Ma
int
en
an
Peak emission wavelength
ce
Radiant power
Capacitance between pins
*
P
O
Classifications
Class
P
O
(mW)
R
5 to 8
S
>7
d
pla inc
Pl
ea
ne lud
se
pla m d m es
ne ain ain foll
htt visit
d d te te ow
p:/ fo
/w llo dis isc nan nan ing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
e
life
an ut
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
/ ion
.
Ratings
160
100
1.5
3
Unit
mW
mA
A
V
ø6.0±0.2
M
ain
Di
sc te
on na
tin nc
ue e/
d
Good radiant power output linearity with respect to input current
13.5±1.0
11.5±1.0
3.6±0.3
1.0
1.0
1: Cathode
2: Anode
–25 to +85
˚C
– 40 to +100
˚C
tin
ue
Conditions
min
5
typ
8
max
Unit
nm
V
/D
I
F
= 50mA
I
F
= 50mA
I
F
= 50mA
V
R
= 3V
mW
nm
950
50
1.3
35
25
I
F
= 100mA
1.6
10
µA
pF
V
R
= 0V, f = 1MHz
The angle in which radiant intencity is 50%
deg.
1
Caution for Safety
¢
This product contains Gallium Arsenide (GaAs).
DANGER
GaAs powder and vapor are hazardous to human health if inhaled or
ingested. Do not burn, destroy, cut, cleave off, or chemically dissolve the
product. Follow related laws and ordinances for disposal. The product
should be excluded from general industrial waste or household garbage.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
If you have any inquiries or questions about this book or our semiconductor products, please contact one
of our sales offices listed on the back or Semiconductor Company's Department.
Pl
pla nc
ea
ne lud
se
pla m d m es
ne ain ain foll
htt visit
d d te te ow
p:/ fo
/w llo dis isc nan nan ing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
/ ion
.
Ma
int
en
an
ce
M
ain
Di
sc te
on na
tin nc
ue e/
d
/D
isc
on
tin
ue
di
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
京公网安备 11010802033920号
EEWORLD
