LH5116-10F datasheet, PDF - EEWORLD Datasheet

LH5116-10F: DescriptionStandard SRAM, 2KX8, 100ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24; Categorystorage storage; File Size340KB，19 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/; Environmental Compliance

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LH5116-10F Overview

Standard SRAM, 2KX8, 100ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-24
Reach Compliance Code	unknown
Maximum access time	100 ns
JESD-30 code	R-PDIP-T24
length	31 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.3 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

RODUCT

PECIFICATION

Integrated Circuits Group

LH5116-10F

16K SRAM

(Model Number: LH511613)

Spec. Issue Date: Oct. 26, 2004

Spec No: EL16X147

	LH5116-10F
Description	Standard SRAM, 2KX8, 100ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24
Is it Rohs certified?	conform to
Maker	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-24
Reach Compliance Code	unknown
Maximum access time	100 ns
JESD-30 code	R-PDIP-T24
length	31 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.3 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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