MCM36256SG70 datasheet, PDF - EEWORLD Datasheet

MCM36256SG70: DescriptionMEMORY MODULE,DRAM,FAST PAGE,256KX36,CMOS,SSIM,72PIN,PLASTIC; Categorystorage storage; File Size703KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM36256SG70 Overview

MEMORY MODULE,DRAM,FAST PAGE,256KX36,CMOS,SSIM,72PIN,PLASTIC

Parameter Name	Attribute value
Maker	NXP
package instruction	SIMM, SSIM72
Reach Compliance Code	unknown
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PSMA-N72
memory density	9437184 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	36
Number of terminals	72
word count	262144 words
character code	256000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum standby current	0.012 A
Maximum slew rate	0.94 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE

	MCM36256SG70	MCM36256S10	MCM36256S80
Description	MEMORY MODULE,DRAM,FAST PAGE,256KX36,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,256KX36,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,256KX36,CMOS,SSIM,72PIN,PLASTIC
Maker	NXP	NXP	NXP
package instruction	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	70 ns	100 ns	80 ns
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72
memory density	9437184 bit	9437184 bit	9437184 bit
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	36	36	36
Number of terminals	72	72	72
word count	262144 words	262144 words	262144 words
character code	256000	256000	256000
Maximum operating temperature	70 °C	70 °C	70 °C
organize	256KX36	256KX36	256KX36
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SIMM	SIMM	SIMM
Encapsulate equivalent code	SSIM72	SSIM72	SSIM72
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512
Maximum standby current	0.012 A	0.012 A	0.012 A
Maximum slew rate	0.94 mA	0.72 mA	0.82 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	SINGLE	SINGLE	SINGLE

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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