4 Banks x 2M x 16bits Synchronous DRAM
DESCRIPTION
The Hynix HY57V281620HC(L/S)TP is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications
which require large memory density and high bandwidth. HY57V281620HC(L/S)TP is organized as 4banks of 2,097,152x16
HY57V281620HC(L/S)TP is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are
synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input
and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated
by a single control command (Burst length of 1,2,4,8, or full page), and the burst count sequence(sequential or interleave). A burst of
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)
HY57V281620HC(L/S)TP
FEATURES
•
•
•
Single 3.3±0.3V power supply
All device pins are compatible with LVTTL interface
JEDEC standard 400mil 54pin TSOP-II(Lead free) with
0.8mm of pin pitch
All inputs and outputs referenced to positive edge of system
clock
Data mask function by UDQM or LDQM
Internal four banks operation
•
•
•
•
Auto refresh and self refresh
4096 refresh cycles / 64ms
Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or Full page for Sequential Burst
•
- 1, 2, 4 or 8 for Interleave Burst
Programmable CAS Latency ; 2, 3 Clocks
•
•
ORDERING INFORMATION
Part No.
HY57V281620HCTP-6
HY57V281620HCTP-7
HY57V281620HCTP-K
HY57V281620HCTP-H
HY57V281620HCTP-8
HY57V281620HCTP-P
HY57V281620HCTP-S
HY57V281620HC(L/S)TP-6
HY57V281620HC(L/S)TP-7
HY57V281620HC(L/S)TP-K
HY57V281620HC(L/S)TP-H
HY57V281620HC(L/S)TP-8
HY57V281620HC(L/S)TP-P
HY57V281620HC(L/S)TP-S
Clock Frequency
166MHz
143MHz
133MHz
133MHz
125MHz
100MHz
100MHz
Power
Organization
Interface
Package
Normal
4Banks x 2Mbits x16
166MHz
143MHz
133MHz
133MHz
125MHz
100MHz
100MHz
Low power
LVTTL
400mil 54pin TSOP II
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any re-
sponsibility for use of circuits described. No patent licenses are implied.
3
Rev. 0.1 / Dec. 03
HY57V281620HC(L/S)TP
PIN CONFIGURATION
V
DD
DQ0
V
DDQ
DQ1
DQ2
V
SSQ
DQ3
DQ4
V
DDQ
DQ5
DQ6
V
SSQ
DQ7
V
DD
LDQM
/WE
/CAS
/RAS
/CS
BA0
BA1
A10/AP
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
V
SS
DQ15
V
SSQ
DQ14
DQ13
V
DDQ
DQ12
DQ11
V
SSQ
DQ10
DQ9
V
DDQ
DQ8
V
SS
NC
UDQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
54pin TSOP II
400mil x 875mil
0.8mm pin pitch
PIN DESCRIPTION
PIN
CLK
CKE
CS
BA0, BA1
A0 ~ A11
RAS, CAS, WE
UDQM, LDQM
DQ0 ~ DQ15
V
DD
/V
SS
V
DDQ
/V
SSQ
NC
Clock
Clock Enable
Chip Select
Bank Address
Address
Row Address Strobe, Column
Address Strobe, Write Enable
Data Input/Output Mask
Data Input/Output
Power Supply/Ground
Data Output Power/Ground
No Connection
PIN NAME
DESCRIPTION
The system clock input. All other inputs are registered to the SDRAM on the rising
edge of CLK
Controls internal clock signal and when deactivated, the SDRAM will be one of the
states among power down, suspend or self refresh
Enables or disables all inputs except CLK, CKE, UDQM and LDQM
Selects bank to be activated during RAS activity
Selects bank to be read/written during CAS activity
Row Address : RA0 ~ RA11, Column Address : CA0 ~ CA8
Auto-precharge flag : A10
RAS, CAS and WE define the operation
Refer function truth table for details
Controls output buffers in read mode and masks input data in write mode
Multiplexed data input / output pin
Power supply for internal circuits and input buffers
Power supply for output buffers
No connection
Rev. 0.1 / Dec. 03
4
Embedded System
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