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M27V512-200K1

Description
64KX8 OTPROM, 200ns, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size107KB,16 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

M27V512-200K1 Overview

64KX8 OTPROM, 200ns, PQCC32, PLASTIC, LCC-32

M27V512-200K1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeQFJ
package instructionPLASTIC, LCC-32
Contacts32
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density524288 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.00001 A
Maximum slew rate0.01 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
M27V512
512 Kbit (64Kb x8) Low Voltage UV EPROM and OTP EPROM
s
LOW VOLTAGE READ OPERATION:
3V to 3.6V
FAST ACCESS TIME: 100ns
LOW POWER CONSUMPTION:
– Active Current 10mA at 5MHz
– Standby Current 10µA
28
28
s
s
s
s
s
PROGRAMMING VOLTAGE: 12.75V
±
0.25V
PROGRAMMING TIME: 100µs/byte (typical)
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 3Dh
1
1
FDIP28W (F)
PDIP28 (B)
DESCRIPTION
The M27V512 is a low voltage 512 Kbit EPROM
offered in the two ranges UV (ultra viloet erase)
and OTP (one time programmable). It is ideally
suited for microprocessor systems and is orga-
nized as 65,536 by 8 bits.
The M27V512 operates in the read mode with a
supply voltage as low as 3V. The decrease in op-
erating power allows either a reduction of the size
of the battery or an increase in the time between
battery recharges.
The FDIP28W (window ceramic frit-seal package)
has transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27V512 is offered in PDIP28, PLCC32 and
TSOP28 (8 x 13.4 mm) packages.
Table 1. Signal Names
A0-A15
Q0-Q7
E
GV
PP
V
CC
V
SS
Address Inputs
Data Outputs
Chip Enable
Output Enable
Supply Voltage
Ground
PLCC32 (K)
TSOP28 (N)
8 x 13.4mm
Figure 1. Logic Diagram
VCC
16
A0-A15
8
Q0-Q7
E
GVPP
M27V512
VSS
AI00732B
May 1998
1/16

M27V512-200K1 Related Products

M27V512-200K1 M27V512-250N1 M27V512-250K1 M27V512-200N1
Description 64KX8 OTPROM, 200ns, PQCC32, PLASTIC, LCC-32 64KX8 OTPROM, 250ns, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP-28 64KX8 OTPROM, 250ns, PQCC32, PLASTIC, LCC-32 64KX8 OTPROM, 200ns, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code QFJ TSOP QFJ TSOP
package instruction PLASTIC, LCC-32 8 X 13.40 MM, PLASTIC, TSOP-28 QCCJ, LDCC32,.5X.6 8 X 13.40 MM, PLASTIC, TSOP-28
Contacts 32 28 32 28
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 250 ns 250 ns 200 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-PDSO-G28 R-PQCC-J32 R-PDSO-G28
JESD-609 code e0 e0 e0 e0
length 13.97 mm 11.8 mm 13.995 mm 11.8 mm
memory density 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 28 32 28
word count 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 64KX8 64KX8 64KX8 64KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ LSSOP QCCJ LSSOP
Encapsulate equivalent code LDCC32,.5X.6 TSSOP28,.53,22 LDCC32,.5X.6 TSSOP28,.53,22
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE, LOW PROFILE, SHRINK PITCH CHIP CARRIER SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3/5 V 3.3/5 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 1.25 mm 3.56 mm 1.25 mm
Maximum standby current 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.01 mA 0.03 mA 0.03 mA 0.01 mA
Maximum supply voltage (Vsup) 3.6 V 5.5 V 5.5 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 5 V 5 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND GULL WING J BEND GULL WING
Terminal pitch 1.27 mm 0.55 mm 1.27 mm 0.55 mm
Terminal location QUAD DUAL QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 8 mm 11.455 mm 8 mm
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