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CX02048WAFER

Description
Support Circuit, 1-Func, WAFER-23
CategoryWireless rf/communication    Telecom circuit   
File Size548KB,15 Pages
ManufacturerMindspeed Technologies Inc
Websitehttps://www.macom.com
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CX02048WAFER Overview

Support Circuit, 1-Func, WAFER-23

CX02048WAFER Parametric

Parameter NameAttribute value
MakerMindspeed Technologies Inc
Parts packaging codeWAFER
package instructionDIE,
Contacts23
Reach Compliance Codecompliant
JESD-30 codeR-XUUC-N23
Number of functions1
Number of terminals23
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Certification statusNot Qualified
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelOTHER
Terminal formNO LEAD
Terminal locationUPPER
CX02048
Low Power 3.3 Volt Limiting Amplifier
For Data Rates to 3.3 Gbps
Data Sheet
Preliminary Information
Features
Description
Applications
Pin Descriptions
Measurement Tables
Functional Description
Applications Information
Please use this data sheet in conjunction with the technical information:
CX02048 Product Bulletin:
CX02048 Application Note:
BCC Package Application Note:
Bare Die Application Note:
02048-PBD-001-B
Note 0019 Rev 01
AN0004 Rev 01
Note 0024 Rev 02
Information provided in this Data Sheet is PRELIMINARY and is subject to change without notice.
Mindspeed Technologies™, Inc, Proprietary and Confidential
02048-DSH-001-B
March 2003

CX02048WAFER Related Products

CX02048WAFER CX02048DIEWP
Description Support Circuit, 1-Func, WAFER-23 Support Circuit, 1-Func, DIE-23
Maker Mindspeed Technologies Inc Mindspeed Technologies Inc
Parts packaging code WAFER DIE
package instruction DIE, DIE,
Contacts 23 23
Reach Compliance Code compliant compliant
JESD-30 code R-XUUC-N23 R-XUUC-N23
Number of functions 1 1
Number of terminals 23 23
Maximum operating temperature 85 °C 85 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIE DIE
Package shape RECTANGULAR RECTANGULAR
Package form UNCASED CHIP UNCASED CHIP
Certification status Not Qualified Not Qualified
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level OTHER OTHER
Terminal form NO LEAD NO LEAD
Terminal location UPPER UPPER

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