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LMV1091TMX

Description
1 CHANNEL, AUDIO AMPLIFIER, PBGA25, MICRO, SMD-25
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size834KB,23 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

LMV1091TMX Overview

1 CHANNEL, AUDIO AMPLIFIER, PBGA25, MICRO, SMD-25

LMV1091TMX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionFBGA,
Contacts25
Reach Compliance Codecompliant
ECCN codeEAR99
Nominal bandwidth3.4 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
JESD-30 codeS-PBGA-B25
JESD-609 codee0
length2.015 mm
Number of channels1
Number of functions1
Number of terminals25
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width2.015 mm

LMV1091TMX Related Products

LMV1091TMX LMV1091TM
Description 1 CHANNEL, AUDIO AMPLIFIER, PBGA25, MICRO, SMD-25 1 CHANNEL, AUDIO AMPLIFIER, PBGA25, MICRO, SMD-25
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Texas Instruments Texas Instruments
Parts packaging code BGA BGA
package instruction FBGA, FBGA,
Contacts 25 25
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Nominal bandwidth 3.4 kHz 3.4 kHz
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 code S-PBGA-B25 S-PBGA-B25
JESD-609 code e0 e0
length 2.015 mm 2.015 mm
Number of channels 1 1
Number of functions 1 1
Number of terminals 25 25
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
surface mount YES YES
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form BALL BALL
Terminal pitch 0.4 mm 0.4 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 2.015 mm 2.015 mm
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