EEWORLDEEWORLDEEWORLD

Part Number

Search

PTZ3.9B-TP

Description
Zener Diode, 4.15V V(Z), 6.02%, 1W, Silicon, Unidirectional, DO-214AC, ROHS COMPLIANT, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size148KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

PTZ3.9B-TP Overview

Zener Diode, 4.15V V(Z), 6.02%, 1W, Silicon, Unidirectional, DO-214AC, ROHS COMPLIANT, PLASTIC PACKAGE-2

PTZ3.9B-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AC
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation1 W
Certification statusNot Qualified
Nominal reference voltage3.9 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance6.02%
Working test current40 mA
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
PTZ3.6B
THRU
PTZ36B
1 Watt
Zener Diode
3.6 to 36 Volts


DO-214AC
(SMA)( LEAD

FRAME)
H
Features
Small surface mounting type.
Voltage regulation and voltage limiting
High surge withstand level.
1W of power can be obtained despite compact size.
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
and MSL Rating 1
Maximum Ratings
Parameter
Symbol
P
Tj
Tstg
Limits
1
Unit
W
Power dissipation
Junction temperature
Storage temperature
Mounting


J
150
−55~+150
°C
°C
density of other power components should be taken into consideration
when laying out the
pattern.
A
C
Notes:1.High Temperature Solder Exemption Applied, see EU Directive Annex 7.
E
F
G
D
B
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X
0.058 ” MI N
0.05
MI N
Revision:
2
www.mccsemi.com
1 of 4
2008/03/21

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2611  1159  2099  2205  1954  53  24  43  45  40 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号