Surface Mount RF Schottky
Diodes in SOT-323 (SC-70)
Technical Data
HSMS-280A Series
HSMS-281A Series
HSMS-282A Series
Features
• Surface Mount SOT-323
Package
• Low Turn-On Voltage
(As Low as 0.34 V at 1 mA)
• Low FIT (Failure in Time)
Rate*
• Six-sigma Quality Level
• Single and Dual Versions
• Tape and Reel Options
Available
Package Lead Code
Identification
(Top View)
SINGLE
SERIES
Description/Applications
These Schottky diodes are specifi-
cally designed for analog and
digital applications requiring
devices in SOT-323 surface mount
packages. This series offers a
wide range of specifications and
package configurations to give the
designer wide flexibility. Typical
applications of these Schottky
diodes are mixing, detecting,
switching, sampling, clamping,
and wave shaping.
B
COMMON
ANODE
C
COMMON
CATHODE
E
* For more information see the
Surface Mount Schottky
Reliability Data Sheet.
F
Absolute Maximum Ratings, T
C
= 25ºC
Symbol Parameter
I
f
P
IV
T
J
T
STG
θ
jc
Unit Absolute Maximum
[1]
1
Same as V
BR
150
-65 to 150
150
Forward Current (1µs Pulse) Amp
Peak Inverse Voltage
V
Junction Temperature
°C
Storage Temperature
°C
Thermal Resistance
[2]
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. T
C
= +25°C, where T
C
is defined to be the temperature at the pack-
age pins where contact is made to the circuit board.
2
Electrical Specifications, T
C
= +25°C, Single Diode
[1]
Part
Package
Number Marking Lead
HSMS- Code
[2]
Code Configuration
280B
A0
280C
A2
280E
A3
280F
A4
281B
B0
281C
B2
281E
B3
281F
B4
282B
C0
282C
C2
282E
C3
282F
C4
Test Conditions
B
C
E
F
B
C
E
F
B
C
E
F
Single
Series
Common Anode
Common Cathode
Single
Series
Common Anode
Common Cathode
Single
Series
Common Anode
Common Cathode
Minimum
Breakdown
Voltage
V
BR
(V)
70
Maximum
Forward
Voltage
V
F
(mV)
400
Maximum
Forward
Voltage
V
F
(V) @
I
F
(mA)
1.0
15
Maximum
Typical
Reverse Maximum
Dynamic
Leakage Capacitance Resistance
I
R
(nA) @ C
T
(pF)
R
D
(Ω)
V
R
(V)
200
50
2.0
35
20
400
1.0
35
200
15
1.2
15
15
340
0.7
30
100
1
1.0
12
I
R
= 10
µA
I
F
= 1 mA
[3]
V
F
= 0 V
I
F
= 5 mA
f=1
MHz
[4]
Notes:
1. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at
5 mA, except HSMS-282X which is measured at 20 mA.
2. Package marking code is laser marked.
3.
∆V
F
for diodes in pairs is 15.0 mV maximum at 1.0 mA.
4. ∆C
TO
for diodes in pairs is 0.2 pF maximum.
Typical Performance, T
C
= 25°C (unless otherwise noted), Single Diode
100
I
F
– FORWARD CURRENT (mA)
I
F
– FORWARD CURRENT (mA)
100
I
F
– FORWARD CURRENT (mA)
100
10
10
10
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
1
1
1
0.1
0.01
0
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
0
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
0
0.10
0.20
0.30
0.40
0.50
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs.
Forward Voltage at Temperatures—
HSMS-280A Series.
Figure 2. Forward Current vs.
Forward Voltage at Temperatures—
HSMS-281A Series.
Figure 3. Forward Current vs.
Forward Voltage at Temperatures—
HSMS-282A Series.
3
Typical Performance, T
C
= 25°C (unless otherwise noted), Single Diode,
continued
100,000
100,000
100,000
10,000
10,000
10,000
I
R
– REVERSE CURRENT (nA)
I
R
– REVERSE CURRENT (nA)
1000
1000
I
R
– REVERSE CURRENT (nA)
1000
100
100
100
10
1
0
10
20
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
30
40
50
10
1
0
5
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
10
15
10
1
0
5
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
10
15
V
R
– REVERSE VOLTAGE (V)
V
R
– REVERSE VOLTAGE (V)
V
R
– REVERSE VOLTAGE (V)
Figure 4. Reverse Current vs.
Reverse Voltage at Temperatures—
HSMS-280A Series.
Figure 5. Reverse Current vs.
Reverse Voltage at Temperatures—
HSMS-281A Series.
Figure 6. Reverse Current vs.
Reverse Voltage at Temperatures—
HSMS-282A Series.
1000
2
1.25
R
D
– DYNAMIC RESISTANCE (Ω)
C
T
– CAPACITANCE (pF)
C
T
– CAPACITANCE (pF)
0
10
20
30
40
50
1.5
1
100
0.75
1
0.50
10
HSMS-2800 SERIES
HSMS-2810 SERIES
HSMS-2820 SERIES
1
10
100
0.5
0.25
1
0.1
0
V
R
– REVERSE VOLTAGE (V)
0
0
2
4
6
8
10
12
14
16
V
R
– REVERSE VOLTAGE (V)
I
F
– FORWARD CURRENT (mA)
Figure 7. Dynamic Resistance vs.
Forward Current.
Figure 8. Total Capacitance vs.
Reverse Voltage—HSMS-280A Series.
Figure 9. Total Capacitance vs.
Reverse Voltage—HSMS-281A Series.
1
C
T
– CAPACITANCE (pF)
0.8
0.6
0.4
0.2
0
0
2
4
6
8
V
R
– REVERSE VOLTAGE (V)
Figure 10. Total Capacitance vs.
Reverse Voltage—HSMS-282A Series.
4
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 11
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair the performance.
0.026
0.07
0.035
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323
package, will reach solder reflow
temperatures faster than those
with a greater mass.
HP’s SOT-323 diodes have been
qualified to the time-temperature
profile shown in Figure 12. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235
°C.
These parameters are typical for a
surface mount assembly process
for HP SOT-323 diodes. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
0.016
Figure 11. PCB Pad Layout
(dimensions in inches).
250
T
MAX
200
TEMPERATURE (°C)
150
Reflow
Zone
100
Preheat
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Cool Down
Zone
Figure 12. Surface Mount Assembly Profile.
5
Package Dimensions
Outline SOT-323 (SC-70 3 Lead)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.425 (0.017)
TYP.
0.30 REF.
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031)
10°
0.30 (0.012)
0.10 (0.004)
0.20 (0.008)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Part Number Ordering Information
Part Number
HSMS-28XA-TR1*
HSMS-28XA-BLK*
No. of Devices
3000
100
Container
7" Reel
antistatic bag
* where X = 0, 1, or 2; A = B, C, E, or F
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