†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
BC807−16LT1, BC807−25LT1, BC807−40LT1
1000
V
CE
= −1.0 V
T
A
= 25°C
hFE, DC CURRENT GAIN
100
10
−0.1
−1.0
−10
−100
I
C
, COLLECTOR CURRENT (mA)
−1000
Figure 1. DC Current Gain
VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS)
−1.0
T
J
= 25°C
−0.8
−0.6
−0.4
I
C
= −300 mA
−0.2
0
−0.01
I
C
= −10 mA
−0.1
−1.0
−10
I
B
, BASE CURRENT (mA)
−100
I
C
= −100 mA
I
C
=
−500 mA
V, VOLTAGE (VOLTS)
−1.0
T
A
= 25°C
−0.8
−0.6
−0.4
−0.2
V
CE(sat)
@ I
C
/I
B
= 10
0
−1.0
−10
−100
I
C
, COLLECTOR CURRENT (mA)
−1000
V
BE(sat)
@ I
C
/I
B
= 10
V
BE(on)
@ V
CE
= −1.0 V
Figure 2. Saturation Region
Figure 3. “On” Voltages
θ
V, TEMPERATURE COEFFICIENTS (mV/
°
C)
+1.0
q
VC
for V
CE(sat)
100
0
C, CAPACITANCE (pF)
C
ib
10
C
ob
−1.0
q
VB
for V
BE
−2.0
−1.0
−10
−100
I
C
, COLLECTOR CURRENT
−1000
1.0
−0.1
−1.0
−10
V
R
, REVERSE VOLTAGE (VOLTS)
−100
Figure 4. Temperature Coefficients
Figure 5. Capacitances
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3
BC807−16LT1, BC807−25LT1, BC807−40LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
3
SEE VIEW C
E
1
2
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
b
e
q
A
L
A1
L1
VIEW C
0.25
DIM
A
A1
b
c
D
E
e
L
L1
H
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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