IC TTL/H/L SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, FF/Latch
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| series | TTL/H/L |
| JESD-30 code | R-GDFP-F16 |
| JESD-609 code | e0 |
| length | 9.6645 mm |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.016 A |
| Number of digits | 2 |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | COMPLEMENTARY |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 46 mA |
| Prop。Delay @ Nom-Sup | 40 ns |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2.032 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | HIGH LEVEL |
| width | 6.604 mm |
| DM5475W | 5475DMQB | 5475FMQB | DM5475J | |
|---|---|---|---|---|
| Description | IC TTL/H/L SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, FF/Latch | IC TTL/H/L SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, FF/Latch | IC TTL/H/L SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, FF/Latch | IC TTL/H/L SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, FF/Latch |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| package instruction | DFP, FL16,.3 | CERAMIC, DIP-16 | CERAMIC, FP-16 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| series | TTL/H/L | TTL/H/L | TTL/H/L | - |
| JESD-30 code | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 | - |
| JESD-609 code | e0 | e0 | e0 | - |
| length | 9.6645 mm | 19.43 mm | 9.6645 mm | - |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | - |
| MaximumI(ol) | 0.016 A | 0.016 A | 0.016 A | - |
| Number of digits | 2 | 2 | 2 | - |
| Number of functions | 2 | 2 | 2 | - |
| Number of terminals | 16 | 16 | 16 | - |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - |
| Output polarity | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| encapsulated code | DFP | DIP | DFP | - |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | FL16,.3 | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | FLATPACK | IN-LINE | FLATPACK | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | 5 V | 5 V | 5 V | - |
| Maximum supply current (ICC) | 46 mA | 46 mA | 46 mA | - |
| Prop。Delay @ Nom-Sup | 40 ns | 40 ns | 40 ns | - |
| propagation delay (tpd) | 15 ns | 40 ns | 15 ns | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 2.032 mm | 5.08 mm | 2.032 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - |
| surface mount | YES | NO | YES | - |
| technology | TTL | TTL | TTL | - |
| Temperature level | MILITARY | MILITARY | MILITARY | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | - |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | - |
| Terminal location | DUAL | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Trigger type | HIGH LEVEL | HIGH LEVEL | HIGH LEVEL | - |
| width | 6.604 mm | 7.62 mm | 6.604 mm | - |