TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | TTL/H/L |
| JESD-30 code | R-GDIP-T14 |
| length | 19.43 mm |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Maximum supply current (ICC) | 6 mA |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| DM5430J/883 | 5430DMQB | DM5430W/883 | |
|---|---|---|---|
| Description | TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | IC TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | DIP | DIP | DFP |
| package instruction | DIP, | DIP, DIP14,.3 | DFP, |
| Contacts | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown |
| series | TTL/H/L | TTL/H/L | - |
| JESD-30 code | R-GDIP-T14 | R-GDIP-T14 | - |
| length | 19.43 mm | 19.43 mm | - |
| Load capacitance (CL) | 15 pF | 15 pF | - |
| Logic integrated circuit type | NAND GATE | NAND GATE | - |
| Number of functions | 1 | 1 | - |
| Number of entries | 8 | 8 | - |
| Number of terminals | 14 | 14 | - |
| Maximum operating temperature | 125 °C | 125 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| encapsulated code | DIP | DIP | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | IN-LINE | - |
| Maximum supply current (ICC) | 6 mA | 6 mA | - |
| propagation delay (tpd) | 15 ns | 15 ns | - |
| Certification status | Not Qualified | Not Qualified | - |
| Maximum seat height | 5.08 mm | 5.08 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - |
| surface mount | NO | NO | - |
| technology | TTL | TTL | - |
| Temperature level | MILITARY | MILITARY | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | 2.54 mm | 2.54 mm | - |
| Terminal location | DUAL | DUAL | - |
| width | 7.62 mm | 7.62 mm | - |
| Factory Lead Time | - | 1 week | 1 week |