TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
BZG03-C10 ~ BZG03-C200
FEATURES :
VOLTAGE REGULATOR DIODES
SMA
* Excellent stability
* Low leakage current
* Pb / RoHS Free
1.6
±
0.25
2.6
±
0.15
2.3
±
0.2
MECHANICAL DATA :
* Case : SMA Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.060 gram (Approximately)
1.6
±
0.25
Dimensions in millimeters
MAXIMUM RATINGS
Rating at 25 °C ambient temperature unless otherwise specified
Parameter
Power dissipation
Power dissipation
Symbol
P
tot
P
tot
Condition
Ttp = 100 °C, see Fig. 1
Ta = 50 °C, see Fig. 1; device
mounted on an Al
2
O
3
PCB (Fig. 4)
tp = 100 µs; square pulse;
Tj = 25°C prior to surge; see Fig. 2
I
F
= 0.5 A; Tj = 25 °C; see Fig. 3
5.3
±
0.35
4.2
±
0.25
* Complete Voltage Range 10 to 200 Volts
* High maximum operating temperature
1.3
±
0.2
Min.
-
-
Max.
3
1.25
Unit
W
W
Non-repetitive peak reverse
Forward voltage
Junction Temperature Range
Storage Temperature Range
P
ZSM
V
F
T
j
T
stg
-
-
-65
-65
600
1.2
+175
+175
W
V
°C
°C
THERMAL CHARACTERISTICS
Parameter
Thermal resistance from junction to tie-point
Thermal resistance from junction to ambient
Note
1. Device mounted on an AlO
3
printed-circuit board, 0.7 mm thick; thickness of Cu-layer
≥35
µm, see Fig.4.
2
Symbol
R
th j-tp
R
th j-a
(Note 1)
Condition
Value
25
100
Unit
K/W
K/W
Page 1 of 3
Rev. 08 : September 18, 2008
TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
ELECTRICAL CHARACTERISTICS
Rating at Tj = 25 °C unless otherwise specified
Working Voltage
Differental
Resistance
Temperature
Coefficient
Test
Current
Maximum Reverse
Leakage Current
Type No.
Marking
Code
Min.
C10
C11
C12
C13
C15
C16
C18
C20
C22
C24
C27
C30
C33
C36
C39
C43
C47
C51
C56
C62
C68
C75
C82
C91
C100
C110
C120
C130
C150
C160
C180
C200
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
31
34
37
40
44
48
52
58
64
70
77
85
94
104
114
124
138
153
168
188
V
Z
@ I
Z
Nom.
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
Max.
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
35
38
41
46
50
54
60
66
72
79
87
96
106
116
127
141
156
171
191
212
r
diff
(Ω) at I
Z
Typ.
2
4
4
5
5
6
6
6
6
7
7
8
8
21
21
24
24
25
25
25
25
30
30
60
60
80
80
110
130
150
180
200
Max.
4
7
7
10
10
15
15
15
15
15
15
15
15
40
40
45
45
60
60
80
80
100
100
200
200
250
250
300
300
350
400
500
S
Z
(%/K) at I
Z
Min.
0.05
0.05
0.05
0.05
0.05
0.05
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.07
0.07
0.07
0.07
0.08
0.08
0.08
0.08
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
Max.
0.09
0.10
0.10
0.10
0.10
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.12
0.12
0.12
0.12
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
I
Z
(mA)
50
50
50
50
50
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
10
5
5
5
5
5
5
5
5
5
I
R
@ V
R
(μA)
7.0
4.0
3.0
2.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
(V)
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
BZG03-C10
BZG03-C11
BZG03-C12
BZG03-C13
BZG03-C15
BZG03-C16
BZG03-C18
BZG03-C20
BZG03-C22
BZG03-C24
BZG03-C27
BZG03-C30
BZG03-C33
BZG03-C36
BZG03-C39
BZG03-C43
BZG03-C47
BZG03-C51
BZG03-C56
BZG03-C62
BZG03-C68
BZG03-C75
BZG03-C82
BZG03-C91
BZG03-C100
BZG03-C110
BZG03-C120
BZG03-C130
BZG03-C150
BZG03-C160
BZG03-C180
BZG03-C200
Page 2 of 3
Rev. 08 : September 18, 2008
TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
RATING AND CHARACTERISTIC CURVES ( BZG03-C10 ~ BZG03-C200 )
FIG.1 - Maximum total power dissipation as a
function of temperature.
FIG.2 - Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
P
tot
(W)
4
P
ZSM
(W)
10
4
3
10
3
2
10
2
1
0
0
100
10
T, (°C)
175
10
-2
10
-1
1
tp (ms)
10
Solid line: tie-point temperature.
Dotted line: ambient temperature; device mounted
on an Al
2
O
3
PCB as shown in Fig.5.
Tj= 25 °C prior to surge.
FIG. 3 - Forward current as a function of forward
voltage; typical values.
3
I
F
(A)
FIG.4 - Printed-circuit board for surface mounting.
50
4.5
2
50
□
2.5
1
1.25
0
0
1
V
F
(V)
2
Dimensions in mm.
Tj= 25 °C.
Page 3 of 3
Rev. 08 : September 18, 2008
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