DPST, 2 Func, CDIP16,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DPST |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| normal position | NO |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -20 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| switch | BREAK-BEFORE-MAKE |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DG185BP | DG184AL/883 | DG185AL/883 | |
|---|---|---|---|
| Description | DPST, 2 Func, CDIP16, | DPST, 2 Func, CDFP14, | DPST, 2 Func, CDFP14, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Vishay | Vishay | Vishay |
| Parts packaging code | DIP | DFP | DFP |
| package instruction | DIP, DIP16,.3 | DFP, FL14,.3 | DFP, FL14,.3 |
| Contacts | 16 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | DPST | DPST | DPST |
| JESD-30 code | R-XDIP-T16 | R-XDFP-F14 | R-XDFP-F14 |
| JESD-609 code | e0 | e0 | e0 |
| normal position | NO | NO | NO |
| Number of functions | 2 | 2 | 2 |
| Number of terminals | 16 | 14 | 14 |
| Maximum operating temperature | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | -20 °C | -55 °C | -55 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP | DFP |
| Encapsulate equivalent code | DIP16,.3 | FL14,.3 | FL14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | YES |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| Temperature level | OTHER | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Filter level | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Base Number Matches | - | 1 | 1 |