Small Outline Optoisolators
Darlington Output
These devices consist of a gallium arsenide infrared emitting diode optically
coupled to a monolithic silicon photodarlington detector, in a surface mountable,
small outline, plastic package. They are ideally suited for high density
applications, and eliminate the need for through–the–board mounting.
•
Convenient Plastic SOIC–8 Surface Mountable Package Style
•
High Current Transfer Ratio (CTR) at Low LED Input Current, for Easier Logic
Interfacing
•
Standard SOIC–8 Footprint, with 0.050″ Lead Spacing
•
Available in Tape and Reel
•
Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
•
High Input–Output Isolation of 3000 Vac (rms) Guaranteed
•
UL Recognized
Ordering Information:
•
To obtain MOC223 in Tape and Reel, add R2 suffix to device numbers:
R2 = 2500 units on 13″ reel
•
To obtain MOC223 in quantities of 50 (shipped in sleeves) — No Suffix
Marking Information:
•
MOC223 = 223
Applications:
•
Low power Logic Circuits
•
Interfacing and coupling systems of different potentials and impedances
•
Telecommunications equipment
•
Portable electronics
MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Rating
INPUT LED
Forward Current — Continuous
Forward Current — Peak (PW = 100
µs,
120 pps)
Reverse Voltage
LED Power Dissipation @ TA = 25°C
Derate above 25°C
OUTPUT DARLINGTON
Collector–Emitter Voltage
Collector–Base Voltage
Emitter–Collector Voltage
Collector Current — Continuous
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
VCEO
VCBO
VECO
IC
PD
30
70
7.0
150
150
1.76
V
V
V
mA
mW
mW/°C
IF
IF(pk)
VR
PD
60
1.0
6.0
90
0.8
mA
A
V
mW
mW/°C
Symbol
Value
Unit
MOC223
SMALL OUTLINE
OPTOISOLATORS
DARLINGTON OUTPUT
File #E90700, Volume 2
SCHEMATIC
1
2
3
4
8
7
6
5
1.
2.
3.
4.
5.
6.
7.
8.
LED ANODE
LED CATHODE
NO CONNECTION
NO CONNECTION
EMITTER
COLLECTOR
BASE
NO CONNECTION
MOC223
MAXIMUM RATINGS — continued
(TA = 25°C unless otherwise noted)
Rating
TOTAL DEVICE
Input–Output Isolation Voltage(1,2)
(60 Hz, 1.0 sec. duration)
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
Ambient Operating Temperature Range(3)
Storage Temperature Range(3)
Lead Soldering Temperature
(1/16″ from case, 10 sec. duration)
VISO
PD
TA
Tstg
—
3000
250
2.94
–45 to +100
–45 to +125
260
Vac(rms)
mW
mW/°C
°C
°C
°C
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)(4)
Characteristic
INPUT LED
Forward Voltage (IF = 1.0 mA)
Reverse Leakage Current (VR = 6.0 V)
Capacitance
OUTPUT DARLINGTON
Collector–Emitter Dark Current
(VCE = 5.0 V, TA = 25°C)
ICEO1
ICEO2
V(BR)CEO
V(BR)ECO
CCE
IC (CTR)(5)
VCE(sat)
ton
toff
tr
tf
VISO
RISO
CISO
—
—
30
7.0
—
1.0
1.0
90
7.8
5.5
50
—
—
—
—
nA
µA
V
V
pF
VF
IR
C
—
—
—
1.05
0.1
18
1.3
100
—
V
Symbol
Min
Typ
(4)
Max
Unit
m
A
pF
(VCE = 5.0 V, TA = 100°C)
Collector–Emitter Breakdown Voltage (IC = 100
µA)
Emitter–Collector Breakdown Voltage (IE = 100
µA)
Collector–Emitter Capacitance (f = 1.0 MHz, VCE = 0)
COUPLED
Output Collector Current
(IF = 1.0 mA, VCE = 5.0 V)
Collector–Emitter Saturation Voltage (IC = 500
µA,
IF = 1.0 mA)
Turn–On Time (IF = 5.0 mA, VCC = 10 V, RL = 100
Ω)
Turn–Off Time (IF = 5.0 mA, VCC = 10 V, RL = 100
Ω)
Rise Time (IF = 5.0 mA, VCC = 10 V, RL = 100
Ω)
Fall Time (IF = 5.0 mA, VCC = 10 V, RL = 100
Ω)
Input–Output Isolation Voltage (f = 60 Hz, t = 1.0 sec.)(1,2)
Isolation Resistance (VI–O = 500 V)(2)
Isolation Capacitance (VI–O = 0, f = 1.0 MHz)(2)
1.
2.
3.
4.
5.
5.0 (500)
—
—
—
—
—
3000
1011
—
10 (1000)
—
3.5
95
1.0
2.0
—
—
0.2
—
1.0
—
—
—
—
—
—
—
mA (%)
V
µs
µs
µs
µs
Vac(rms)
Ω
pF
Input–Output Isolation Voltage, VISO, is an internal device dielectric breakdown rating.
For this test, pins 1 and 2 are common, and pins 5, 6 and 7 are common.
Refer to Quality and Reliability Section in Opto Data Book for information on test conditions.
Always design to the specified minimum/maximum electrical limits (where applicable).
Current Transfer Ratio (CTR) = IC/IF x 100%.
MOC223
TYPICAL CHARACTERISTICS
2
VF , FORWARD VOLTAGE (VOLTS)
PULSE ONLY
PULSE OR DC
IC, OUTPUT COLLECTOR CURRENT (NORMALIZED)
100
NORMALIZED TO:
IF = 1 mA
10
1.8
1.6
1.4
TA = – 45°C
1.2
25°C
100°C
1
10
100
IF, LED FORWARD CURRENT (mA)
1000
1
1
0.1
0.1
1
10
IF, LED INPUT CURRENT (mA)
100
Figure 1. LED Forward Voltage versus Forward Current
I C, OUTPUT COLLECTOR CURRENT (NORMALIZED)
Figure 2. Output Current versus Input Current
14
I C, OUTPUT COLLECTOR CURRENT (mA)
12
10
8
6
4
2
0
0
1
2
3
4
5
6
7
8
9
10
IF = 1 mA
10
NORMALIZED TO:
TA = 25°C
1
0.1
–60
–40
–20
0
20
40
60
80
100
120
TA, AMBIENT TEMPERATURE (°C)
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 3. Output Current versus
Collector–Emitter Voltage
Figure 4. Output Current versus
Ambient Temperature
ICEO, COLLECTOR–EMITTER DARK CURRENT
(NORMALIZED)
1000
NORMALIZED TO:
VCE = 5 V
TA = 25°C
20
18
16
C, CAPACITANCE (pF)
14
12
10
8
6
4
2
0
0.01
0.1
1
V, VOLTAGE (VOLTS)
CEB
10
CCB
CLED
f = 1 MHz
100
10
VCE = 30 V
10 V
1
5V
0.1
0
20
40
60
80
100
CCE
100
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Dark Current versus Ambient Temperature
Figure 6. Capacitance versus Voltage
MOC223
PACKAGE DIMENSIONS
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
8
5
K
1
4
B
G
D
8 PL
0.13 (0.005)
M
T A
M
DIM
A
B
C
D
G
H
J
K
INCHES
MIN
MAX
0.182
0.202
0.144
0.164
0.123
0.143
0.011
0.021
0.050 BSC
0.003
0.008
0.006
0.010
0.224
0.244
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
MILLIMETERS
MIN
MAX
4.63
5.13
3.66
4.16
3.13
3.63
0.28
0.53
1.27 BSC
0.08
0.20
0.16
0.25
5.69
6.19
-T-
SEATING
PLANE
C
0.038 (0.0015)
H
J
ANODE
CATHODE
NC
NC
EMITTER
COLLECTOR
BASE
NC
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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