74AUP2G34GM datasheet, PDF - EEWORLD Datasheet

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74AUP2G34GM: DescriptionLow-power dual buffer; Categorylogic logic; File Size69KB，16 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74AUP2G34GM Overview

Low-power dual buffer

74AUP2G34GM Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SON
package instruction	VSON, SOLCC6,.04,20
Contacts	6
Reach Compliance Code	compli
series	AUP/ULP/V
JESD-30 code	R-PDSO-N6
JESD-609 code	e3
length	1.45 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.0017 A
Humidity sensitivity level	1
Number of functions	1
Number of entries	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Encapsulate equivalent code	SOLCC6,.04,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	1.2/3.3 V
Prop。Delay @ Nom-Su	20.8 ns
propagation delay (tpd)	20.8 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.1 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	1 mm

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74AUP2G34

Low-power dual buffer

Rev. 02 — 31 January 2008

Product data sheet

1. General description

The 74AUP2G34 provides two low-power, low-voltage buffers.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall

times across the entire V

range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire

range from 0.8 V to 3.6 V.

This device is fully speciﬁed for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backﬂow current through

the device when it is powered down.

2. Features

Wide supply voltage range from 0.8 V to 3.6 V

High noise immunity

Complies with JEDEC standards:

JESD8-12 (0.8 V to 1.3 V)

JESD8-11 (0.9 V to 1.65 V)

JESD8-7 (1.2 V to 1.95 V)

JESD8-5 (1.8 V to 2.7 V)

JESD8-B (2.7 V to 3.6 V)

ESD protection:

HBM JESD22-A114E Class 3A exceeds 5000 V

MM JESD22-A115-A exceeds 200 V

CDM JESD22-C101C exceeds 1000 V

Low static power consumption; I

= 0.9

µA

(maximum)

Latch-up performance exceeds 100 mA per JESD 78 Class II

Inputs accept voltages up to 3.6 V

Low noise overshoot and undershoot < 10 % of V

OFF

circuitry provides partial Power-down mode operation

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

74AUP2G34GM Related Products

	74AUP2G34GM	74AUP2G34	74AUP2G34GF	74AUP2G34GW
Description	Low-power dual buffer	Low-power dual buffer	Low-power dual buffer	Low-power dual buffer
Is it lead-free?	Lead free	-	Lead free	Lead free
Is it Rohs certified?	conform to	-	conform to	conform to
Maker	NXP	-	NXP	NXP
Parts packaging code	SON	-	SON	SOT-363
package instruction	VSON, SOLCC6,.04,20	-	VSON, SOLCC6,.04,14	TSSOP, TSSOP6,.08
Contacts	6	-	6	6
Reach Compliance Code	compli	-	compli	compli
series	AUP/ULP/V	-	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-PDSO-N6	-	S-PDSO-N6	R-PDSO-G6
JESD-609 code	e3	-	e3	e3
length	1.45 mm	-	1 mm	2 mm
Load capacitance (CL)	30 pF	-	30 pF	30 pF
Logic integrated circuit type	BUFFER	-	BUFFER	BUFFER
MaximumI(ol)	0.0017 A	-	0.0017 A	0.0017 A
Humidity sensitivity level	1	-	1	1
Number of functions	1	-	1	1
Number of entries	1	-	1	1
Number of terminals	6	-	6	6
Maximum operating temperature	125 °C	-	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	-	VSON	TSSOP
Encapsulate equivalent code	SOLCC6,.04,20	-	SOLCC6,.04,14	TSSOP6,.08
Package shape	RECTANGULAR	-	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	-	260	260
power supply	1.2/3.3 V	-	1.2/3.3 V	1.2/3.3 V
Prop。Delay @ Nom-Su	20.8 ns	-	20.8 ns	20.8 ns
propagation delay (tpd)	20.8 ns	-	20.8 ns	20.8 ns
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Schmitt trigger	NO	-	NO	NO
Maximum seat height	0.5 mm	-	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	-	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.1 V	-	1.1 V	1.1 V
surface mount	YES	-	YES	YES
technology	CMOS	-	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin (Sn)	-	Tin (Sn)	Tin (Sn)
Terminal form	NO LEAD	-	NO LEAD	GULL WING
Terminal pitch	0.5 mm	-	0.35 mm	0.65 mm
Terminal location	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30
width	1 mm	-	1 mm	1.25 mm

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