SM5132CP datasheet, PDF - EEWORLD Datasheet

SM5132CP: DescriptionCordless Telephone IC, CMOS, PDIP16,; CategoryWireless rf/communication Telecom circuit; File Size450KB，6 Pages; ManufacturerSeiko Epson Corporation

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SM5132CP Overview

Cordless Telephone IC, CMOS, PDIP16,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Seiko Epson Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
Number of terminals	16
Maximum operating temperature	80 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3.3/5 V
Certification status	Not Qualified
Maximum slew rate	6 mA
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	SM5132CP	SM5132CS	SM5132DP	SM5132DS
Description	Cordless Telephone IC, CMOS, PDIP16,	Cordless Telephone IC, CMOS, PDSO16,	Cordless Telephone IC, CMOS, PDIP16,	Cordless Telephone IC, CMOS, PDSO16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Seiko Epson Corporation	Seiko Epson Corporation	Seiko Epson Corporation	Seiko Epson Corporation
package instruction	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-PDSO-G16	R-PDIP-T16	R-PDSO-G16
Number of terminals	16	16	16	16
Maximum operating temperature	80 °C	80 °C	80 °C	80 °C
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	SOP
Encapsulate equivalent code	DIP16,.3	SOP16,.25	DIP16,.3	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	6 mA	6 mA	6 mA	6 mA
surface mount	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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