GLZ2.0 ~ GLZ56
500mW SUFACE MOUNT ZENER DIODE
FEATURES
•
Planar Die construction
•
500mW Power Dissipation
•
Ideally Suited for Automated Assembly Processes
•
Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
Pb free: 98.5% Sn above
0.063(1.6)
0.055(1.4)
DIA.
MINI-MELF / LL-34
MECHANICAL DATA
•
Case: Molded Glass MINI-MELF
•
Terminals: Solderable per MIL-STD-750, Method 2026
•
Polarity: See Diagram Below
•
Approx. Weight: 0.03 grams
•
Mounting Position: Any
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.020(0.5)
0.012(0.3)
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)
(T
A
=25℃ )
Symbols
Zener current see table "Characteristics"
Power dissipation at T
A
=25℃
Junction temperature
Storage temperature range
P
tot
T
J
T
STG
Value
Units
mW
500
1)
175
-65 to + 175
℃
℃
1)Valid provided that at a distance of 8mm from case are kept at ambient temperature
ELECTRICAL CHARACTERISTICS
(TA=25℃ )
Symbols
Thermal resistance junction to ambient
Forward voltage
at I
F
=100mA
R
THA
V
F
Min.
Typ.
Max.
0.3
1)
1
Units
K
/mW
V
1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature
GLZ2.0 ~ GLZ56
RATINGS AND CHARACTERISTIC CURVES
P O W E R D I S S I PAT I O N , m Wa t t s
500
400
300
200
100
0
50
100
150
200
O
250
AMBIENT TEMPERATURE, C
FIG. 1 POWER DERATING CURVE
Vz (V)
Iz (mA)
50
40
30
20
10
0
5
10
15
20
25
30
Test Current
Iz = 20mA
24
20
15
12
11
9.1
6.8
6.2
5.6
5.1
4.7
4.3
3.9
2.7
Fig.2 BREAKDOWN CHARACTERISTICS
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