EEWORLDEEWORLDEEWORLD

Part Number

Search

RMPG06D/50-E3

Description
DIODE 1 A, 200 V, SILICON, SIGNAL DIODE, PLASTIC, CASE MPG06, 2 PIN, Signal Diode
CategoryDiscrete semiconductor    diode   
File Size21KB,2 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

RMPG06D/50-E3 Overview

DIODE 1 A, 200 V, SILICON, SIGNAL DIODE, PLASTIC, CASE MPG06, 2 PIN, Signal Diode

RMPG06D/50-E3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionO-PALF-W2
Contacts2
Manufacturer packaging codeCASE MPG06
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeO-PALF-W2
JESD-609 codee3
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current1 A
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT APPLICABLE
Certification statusNot Qualified
Maximum repetitive peak reverse voltage200 V
Maximum reverse recovery time0.15 µs
surface mountNO
Terminal surfaceMATTE TIN
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT APPLICABLE
RMPG06A THRU RMPG06J
Vishay Semiconductors
formerly General Semiconductor
Miniature Glass Passivated
Fast Switching Plastic Rectifier
Case Style MPG06
Reverse Voltage
50 to 600V
Forward Current
1.0A
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• Low forward voltage drops, high current capability
• Glass passivated chip junction
• High surge capability
• Typical I
R
less than 0.1µA
• High temperature soldering guaranteed:
250°C/10 seconds 0.375” (9.5mm) lead length, 5 lbs.
(2.3kg) tension
0.100 (2.54)
0.090 (2.29)
DIA
1.0 (25.4)
MIN.
0.125 (3.18)
0.115 (2.92)
Mechanical Data
Case:
Molded plastic over passivated chip
Terminals:
Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.0064 oz., 0.181 g
Packaging codes/options:
1/5K per Bulk Box
3/3K per Ammo Box (26mm Tape)
4/5.5K per 13" Reel (52mm Tape)
23/3K per Ammo Box (52mm Tape)
50/2.5K per Radial-Tape Ammo Box
Ratings at 25°C ambient temperature unless otherwise specified.
1.0 (25.4)
MIN.
0.025 (0.635)
0.023 (0.584)
DIA.
Dimensions in inches and (millimeters)
Maximum Ratings & Thermal Characteristics
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current,
0.375" (9.5mm) lead length at T
A
=25°C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Typical thermal resistance
(1)
RMPG
06A
50
35
50
RMPG
06B
100
70
70
RMPG
06D
200
140
200
1.0
40
67
30
-55 to +150
RMPG
06G
400
280
400
RMPG
06J
600
420
600
Unit
V
V
V
A
A
°C/W
°C
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
R
ΘJA
R
ΘJL
T
J
, T
STG
Operating junction and storage temperature range
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Symbol
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time at
I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
T
A
=25°C
T
A
=125°C
V
F
I
R
C
J
t
rr
RMPG
06A
RMPG
06B
RMPG
06D
1.3
5.0
50
6.6
150
RMPG
06G
RMPG
06J
Unit
V
µA
pF
Typical junction capacitance at 4.0V, 1MHz
200
ns
Notes:
(1) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length, P.C.B. mounted with 0.22 x 0.22” (5.5 x 5.5mm) copper pads
Document Number 88706
08-Feb-02
www.vishay.com
1
[Serial] [ALIENTEK Battleship STM32 Development Board] STM32 Development Guide--Chapter 9 Serial Port Experiment
[align=left][b]Chapter 9 Serial Port Experiment[/b] The previous two chapters introduced the IO port operation of STM32. In this chapter, we will learn about the serial port of STM32 and teach you how...
正点原子 stm32/stm8
[Silicon Labs BG22-EK4108A Bluetooth Development Evaluation] 1. Unboxing + Data Collection + Development Environment Construction + Lighting
I received the Silicon Labs BG22-EK4108A Bluetooth development board a few days ago. Unfortunately, I have been too busy recently and have not had time to arrange a review. I took advantage of the wee...
zhangjt0713 Development Kits Review Area
HIVE+binfs how to save the registry, the code has been modified, but the function can not be realized, please give me some advice
: According to the relevant information available on the Internet, I have made some modifications. The Hive-base option has been added, and the platform.reg file has been modified accordingly. The fol...
guoqingling988 Embedded System
Please help provide the entire PCB board production process and the SMD component mounting process animation. Thank you
Please help provide the entire PCB board production process and the SMD component mounting process animation. Thank you...
深圳小花 PCB Design
It's time to re-enable the BoosterPack section
It has been a while since everyone has bought MSP432 Launchpad in groups. However, there are few MSP432 sharings in the forums, which makes people feel that most boards are gathering dust. So what is ...
qiushenghua Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1558  733  2746  2597  363  32  15  56  53  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号