SN74HC7266N1 datasheet, PDF - EEWORLD Datasheet

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SN74HC7266N1: DescriptionIC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,DIP,14PIN,PLASTIC; Categorylogic logic; File Size187KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74HC7266N1 Overview

IC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,DIP,14PIN,PLASTIC

SN74HC7266N1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T14
Logic integrated circuit type	XNOR GATE
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

SN74HC7266N1 Related Products

	SN74HC7266N1	SN74HC7266NP1	SN54HC7266FH	SN74HC7266J	SN74HC7266FH
Description	IC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,LLCC,20PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,HC-CMOS,LLCC,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	QCCN, LCC20,.35SQ	DIP, DIP14,.3	QCCN, LCC20,.35SQ
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	_compli
JESD-30 code	R-PDIP-T14	-	S-XQCC-N20	R-XDIP-T14	S-XQCC-N20
Logic integrated circuit type	XNOR GATE	-	XNOR GATE	XNOR GATE	XNOR GATE
Number of terminals	14	-	20	14	20
Maximum operating temperature	85 °C	-	125 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-55 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	-	QCCN	DIP	QCCN
Encapsulate equivalent code	DIP14,.3	-	LCC20,.35SQ	DIP14,.3	LCC20,.35SQ
Package shape	RECTANGULAR	-	SQUARE	RECTANGULAR	SQUARE
Package form	IN-LINE	-	CHIP CARRIER	IN-LINE	CHIP CARRIER
power supply	2/6 V	-	2/6 V	2/6 V	2/6 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	-	NO	NO	NO
surface mount	NO	-	YES	NO	YES
technology	CMOS	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	MILITARY	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	-	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	-	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	-	QUAD	DUAL	QUAD

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