74HC2G02GD datasheet, PDF - EEWORLD Datasheet

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74HC2G02GD: DescriptionDual 2-input NOR gate; Categorylogic logic; File Size69KB，13 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC2G02GD Overview

Dual 2-input NOR gate

74HC2G02GD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SON
package instruction	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8
Contacts	8
Reach Compliance Code	unknown
Is Samacsys	N
series	HC/UH
JESD-30 code	R-PDSO-N8
length	3 mm
Logic integrated circuit type	NOR GATE
Humidity sensitivity level	1
Number of functions	2
Number of entries	2
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	110 ns
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	2 mm
Base Number Matches	1

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74HC2G02; 74HCT2G02

Dual 2-input NOR gate

Rev. 04 — 11 May 2009

Product data sheet

1. General description

The 74HC2G02 and 74HCT2G02 are high-speed Si-gate CMOS devices. They provide

two 2-input NOR gates.

The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.

The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features

Wide supply voltage range from 2.0 V to 6.0 V

Symmetrical output impedance

High noise immunity

Low power dissipation

Balanced propagation delays

Multiple package options

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74HC2G02DP

74HCT2G02DP

74HC2G02DC

74HCT2G02DC

74HC2G02GD

74HCT2G02GD

−40 °C

to +125

°C

XSON8U

−40 °C

to +125

°C

VSSOP8

−40 °C

to +125

°C

TSSOP8

Description

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

Version

SOT505-2

Type number

plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

plastic extremely thin small outline package; no leads; SOT996-2

8 terminals; UTLP based; body 3

0.5 mm

74HC2G02GD Related Products

	74HC2G02GD	74HC2G02	74HC2G02DC	74HC2G02DP	74HCT2G02	74HCT2G02DC	74HCT2G02DP	74HCT2G02GD
Description	Dual 2-input NOR gate	Dual 2-input NOR gate	Dual 2-input NOR gate	Dual 2-input NOR gate	Dual 2-input NOR gate	Dual 2-input NOR gate	Dual 2-input NOR gate	Dual 2-input NOR gate
Is it Rohs certified?	conform to	-	conform to	conform to	-	conform to	conform to	conform to
Maker	NXP	-	NXP	NXP	-	NXP	NXP	NXP
Parts packaging code	SON	-	TSSOP	SOIC	-	TSSOP	SOIC	SON
package instruction	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8	-	VSSOP, TSSOP8,.12,20	TSSOP, TSSOP8,.16	-	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	3 MM, PLASTIC, SOT505-2, TSSOP-8	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8
Contacts	8	-	8	8	-	8	8	8
Reach Compliance Code	unknown	-	compliant	compliant	-	compliant	compliant	unknown
Is Samacsys	N	-	N	N	-	N	N	N
series	HC/UH	-	HC/UH	HC/UH	-	HCT	HCT	HCT
JESD-30 code	R-PDSO-N8	-	R-PDSO-G8	S-PDSO-G8	-	R-PDSO-G8	S-PDSO-G8	R-PDSO-N8
length	3 mm	-	2.3 mm	3 mm	-	2.3 mm	3 mm	3 mm
Logic integrated circuit type	NOR GATE	-	NOR GATE	NOR GATE	-	NOR GATE	NOR GATE	NOR GATE
Humidity sensitivity level	1	-	1	1	-	1	1	1
Number of functions	2	-	2	2	-	2	2	2
Number of entries	2	-	2	2	-	2	2	2
Number of terminals	8	-	8	8	-	8	8	8
Maximum operating temperature	125 °C	-	125 °C	125 °C	-	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	-	VSSOP	TSSOP	-	VSSOP	TSSOP	VSON
Package shape	RECTANGULAR	-	RECTANGULAR	SQUARE	-	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	-	260	260	-	260	260	260
propagation delay (tpd)	110 ns	-	110 ns	110 ns	-	29 ns	29 ns	29 ns
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.5 mm	-	1 mm	1.1 mm	-	1 mm	1.1 mm	0.5 mm
Maximum supply voltage (Vsup)	6 V	-	6 V	6 V	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	-	2 V	2 V	-	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	-	5 V	5 V	5 V
surface mount	YES	-	YES	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	NO LEAD	-	GULL WING	GULL WING	-	GULL WING	GULL WING	NO LEAD
Terminal pitch	0.5 mm	-	0.5 mm	0.65 mm	-	0.5 mm	0.65 mm	0.5 mm
Terminal location	DUAL	-	DUAL	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30	-	30	30	30
width	2 mm	-	2 mm	3 mm	-	2 mm	3 mm	2 mm
Base Number Matches	1	-	1	1	-	1	1	1

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