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74LVC1G99_10

Description
Ultra-configurable multiple function gate; 3-state
File Size201KB,29 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Compare View All

74LVC1G99_10 Overview

Ultra-configurable multiple function gate; 3-state

74LVC1G99
Ultra-configurable multiple function gate; 3-state
Rev. 04 — 16 April 2010
Product data sheet
1. General description
The 74LVC1G99 provides a low voltage, ultra-configurable, multiple function gate with
3-state output. The device can be configured as one of several logic functions including,
AND, OR, NAND, NOR, XOR, XNOR, inverter, buffer and MUX. No external components
are required to configure the device as all inputs can be connected directly to V
CC
or
GND. The 3-state output is controlled by the output enable input (OE). A HIGH level at OE
causes the output (Y) to assume a high-impedance OFF-state. When OE is LOW, the
output state is determined by the signals applied to the Schmitt-trigger inputs (A, B, C and
D).
Due to the use of Schmitt-trigger inputs the device is tolerant of slowly changing input
signals, transforming them into sharply defined, jitter free output signals. By eliminating
leakage current paths to V
CC
and GND, the inputs and disabled output are also
over-voltage tolerant, making the device suitable for mixed-voltage applications.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74LVC1G99 is fully specified over the supply range from 1.65 V to 5.5 V.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant inputs for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
±24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C.

74LVC1G99_10 Related Products

74LVC1G99_10 74LVC1G99GF 74LVC1G99 74LVC1G99GM 74LVC1G99DP 74LVC1G99GD 74LVC1G99GT
Description Ultra-configurable multiple function gate; 3-state Ultra-configurable multiple function gate; 3-state Ultra-configurable multiple function gate; 3-state Ultra-configurable multiple function gate; 3-state Ultra-configurable multiple function gate; 3-state Ultra-configurable multiple function gate; 3-state Ultra-configurable multiple function gate; 3-state
Is it Rohs certified? - conform to - conform to conform to conform to conform to
Maker - NXP - NXP NXP NXP NXP
Parts packaging code - SON - QFN SOIC SON SON
package instruction - 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 - 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8 3 MM, PLASTIC, SOT505-2, TSSOP-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8
Contacts - 8 - 8 8 8 8
Reach Compliance Code - unknow - compli compli unknow compli
series - LVC/LCX/Z - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code - R-PDSO-N8 - S-PQCC-N8 S-PDSO-G8 R-PDSO-N8 R-PDSO-N8
JESD-609 code - e3 - e4 e4 - e3
length - 1.35 mm - 1.6 mm 3 mm 3 mm 1.95 mm
Logic integrated circuit type - MAJORITY LOGIC GATE - MAJORITY LOGIC GATE MAJORITY LOGIC GATE MAJORITY LOGIC GATE MAJORITY LOGIC GATE
Humidity sensitivity level - 1 - 1 1 1 1
Number of functions - 1 - 1 1 1 1
Number of entries - 4 - 4 4 4 4
Number of terminals - 8 - 8 8 8 8
Maximum operating temperature - 125 °C - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C -40 °C -40 °C
Output characteristics - 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VSON - VQCCN TSSOP VSON VSON
Package shape - RECTANGULAR - SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, VERY THIN PROFILE - CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 - 260 260 260 260
propagation delay (tpd) - 38.5 ns - 38.5 ns 38.5 ns 38.5 ns 38.5 ns
Certification status - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 0.5 mm - 0.5 mm 1.1 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) - 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 1.65 V - 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) - 2.3 V - 2.3 V 2.3 V 2.3 V 2.3 V
surface mount - YES - YES YES YES YES
technology - CMOS - CMOS CMOS CMOS CMOS
Temperature level - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - PURE TIN - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - Tin (Sn)
Terminal form - NO LEAD - NO LEAD GULL WING NO LEAD NO LEAD
Terminal pitch - 0.35 mm - 0.5 mm 0.65 mm 0.5 mm 0.5 mm
Terminal location - DUAL - QUAD DUAL DUAL DUAL
Maximum time at peak reflow temperature - 30 - 30 30 30 30
width - 1 mm - 1.6 mm 3 mm 2 mm 1 mm
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