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74LVC2G06

Description
Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85
File Size66KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74LVC2G06 Overview

Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85

74LVC2G06
Inverters with open-drain outputs
Rev. 03 — 21 May 2007
Product data sheet
1. General description
The 74LVC2G06 provides two inverting buffers.
The output of this device is an open drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall
time.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
2. Features
s
s
s
s
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
x
JESD8-7 (1.65 V to 1.95 V)
x
JESD8-5 (2.3 V to 2.7 V)
x
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
−24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
s
s
s
s
s
s
s
s

74LVC2G06 Related Products

74LVC2G06 74LVC2G06GF 74LVC2G06GM 74LVC2G06GW 74LVC2G06GV
Description Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85 Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85 Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85 Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85 Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85
Is it lead-free? - Lead free - Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Maker - NXP NXP NXP NXP
Parts packaging code - SON SON SOT-363 TSOP
package instruction - VSON, SOLCC6,.04,14 VSON, SOLCC6,.04,20 PLASTIC, SOT-363, SC-88, 6 PIN PLASTIC, SOT-457, SC-74, TSOP-6
Contacts - 6 6 6 6
Reach Compliance Code - compliant compliant compli compli
series - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code - S-PDSO-N6 R-PDSO-N6 R-PDSO-G6 R-PDSO-G6
JESD-609 code - e3 e3 e3 e3
length - 1 mm 1.45 mm 2 mm 2.9 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - INVERTER INVERTER INVERTER INVERTER
MaximumI(ol) - 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level - 1 1 1 1
Number of functions - 2 2 2 2
Number of entries - 1 1 1 1
Number of terminals - 6 6 6 6
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Output characteristics - OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VSON VSON TSSOP TSSOP
Encapsulate equivalent code - SOLCC6,.04,14 SOLCC6,.04,20 TSSOP6,.08 TSOP6,.11,37
Package shape - SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 260 260 260
power supply - 3.3 V 3.3 V 3.3 V 3.3 V
propagation delay (tpd) - 8.2 ns 8.2 ns 8.2 ns 8.2 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - NO NO NO NO
Maximum seat height - 0.5 mm 0.5 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) - 1.8 V 1.8 V 1.8 V 1.8 V
surface mount - YES YES YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form - NO LEAD NO LEAD GULL WING GULL WING
Terminal pitch - 0.35 mm 0.5 mm 0.65 mm 0.95 mm
Terminal location - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - 30 30 30 30
width - 1 mm 1 mm 1.25 mm 1.5 mm
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