HY62QF8100LLM-85 datasheet, PDF

HY62QF8100LLM-85: DescriptionStandard SRAM, 128KX8, 85ns, CMOS, PBGA48, MICRO, BGA-48; Categorystorage storage; File Size470KB，12 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY62QF8100LLM-85 Overview

Standard SRAM, 128KX8, 85ns, CMOS, PBGA48, MICRO, BGA-48

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	85 ns
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	6.5 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.11 mm
Maximum supply voltage (Vsup)	2.8 V
Minimum supply voltage (Vsup)	2.2 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6.2 mm

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