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Note the following precautions when using semiconductor devices.
[Precautions for light]
Due to the solar battery principle, the characteristics of the semiconductor devices generally change when
the devices are irradiated. This IC, therefore, may malfunction when exposed to light.
Since this IC is not completely lightproof, follow the precautions below when using a substrate or product
on which it is mounted.
(1) Design and mount the substrate or product so as to block out any light from reaching the IC during
actual use.
(2) For the inspection process, design the environments so as to block out any light from reaching the
IC.
(3) When blocking out light, take all surfaces of the IC chip into account.
© Seiko Epson corporation 1998 All right reserved.
i8088 and i8086 are registered trademarks of Intel Corporation.
Z80 is registered trademark of Zilog Corporation.
V20 and V30 are registered trademarks of Nippon Electric Corporation.
s
LCD controller-drivers for
small-sized displays
Built-in character generators together with segment and common drivers simplify the
task of displaying microprocessor messages on small LCDs.
Part number
SED1200D
0A
Supply voltage LCD voltage
range (V)
range (V)
Duty
Segment Common
Display
Micropro-
RAM
cessor
(characters) interface
Extension
display
output
Package
Comment
JIS character
AI pad chip
SED1200D
0B
4-bit
SED1200F
0A
SED1200F
0B
SED1200F
1B
SED1210D
0A
AI pad chip
SED1210D
0B
40
SED1210F
0A
SED1210F
0B
SED1220D
XB
26
SED1220T
XX
4 or 8-bit
SED1221D
XB
parallel
SED1221T
XX
SED1220D
XA
SED122AD
XB
SED122AT
XX
SED1225D
XB
1.7–3.6
SED1225T
XB
SED1278D
1/18,1/11,
SED1278F
SED1280F
SED1230D
1/30
SED1230T
SED1231D
1/23
SED1231T
SED1232D
2.4–3.6
SED1232T
1/16
SED1233D
80
SED1233T
SED1234D
SED1235D
SED1240D
XB
1/34
SED1240T
XX
SED1241D
XB
1.8–5.5
SED1241T
XX
SED1242D
XB
1/18
SED1242T
XX
18
TCP
5.0–16.0
1/26
80
26
80
TCP
Au bump chip
34
TCP
Au bump chip
1/30
62
1/16
16
Serial
AI pad chip
Au bump chip
SED1234/35
LCD dynamic drive only.
30
parallel
–
or
AI pad chip
TCP
SED1230/31/32/33
LCD static drive allowed
16
4 or 8-bit
Au bump chip
4.0–12.0
48
TCP
Built-in power circuit for
LCD
Three standard characters
(JIS, ASCII, Cellular)
65
23
TCP
Au bump chip
30
TCP
Au bump chip
4.5–5.5
3.0–5.5
1/16
Serial
QFP5-100pin
Au bump chip
40
16
80
parallel
Serial
QFP5-80pin
3.0–6.0
1/18,1/26
64
26
36
4 or 8-bit
parallel
or Serial
4 or 8-bit
2.4–3.6
4.0–7.0
1/18,1/26
62
18
Serial
Au bump chip
TCP
36
or
AI pad chip
Au bump chip
TCP
Au bump chip
40
parallel
QFP5-80pin
ASCII character
4 or 8-bit
Serial
JIS character
ASCII character
2.5–5.5
3.5–5.5
1/8,1/16
16
50
20
ASCII character
parallel
–
JIS character
QFP1-80pin
ASCII character
QFP14-80pin
JIS character
–
TCP
LCD static drive allowed
Three standard characters
(JIS, ASCII, Cellular)
–
Au bump chip
TCP
AI pad chip
Six standard
characters
(0A/0B/0C/0E/0G/0H)
Three standard character
(0A/0B/0C)
1–1