BA682.BA683
Silicon Planar Diodes
Features
D
Low differential forward resistance
D
Low diode capacitance
D
High reverse impedance
Applications
Band switching in VHF–tuners
94 9371
Absolute Maximum Ratings
T
j
= 25
_
C
Parameter
Reverse voltage
Forward current
Junction temperature
Storage temperature range
Test Conditions
Type
Symbol
V
R
I
F
T
j
T
stg
Value
35
100
150
–55...+150
Unit
V
mA
°
C
°
C
Maximum Thermal Resistance
T
j
= 25
_
C
Parameter
Junction ambient
Test Conditions
on PC board 50mmx50mmx1.6mm
Symbol
R
thJA
Value
500
Unit
K/W
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
1 (4)
BA682.BA683
Characteristics
T
j
= 25
_
C
Parameter
Forward voltage
Reverse current
Diode capacitance
p
Test Conditions
I
F
=100mA
V
R
=20V
f=100MHz, V
R
=1V
f=100MHz, V
R
=3V
,
f=200MHz, I
F
=3mA
,
f=200MHz, I
F
=10mA
,
Type
Symbol
V
F
I
R
C
D
C
D
C
D
r
f
r
f
r
f
r
f
Min
Typ
Max
1
50
1.5
1.25
1.2
0.7
1.2
0.5
0.9
Unit
V
nA
pF
pF
pF
Differential forward
resistance
BA682
BA683
BA682
BA683
BA682
BA683
W
W
W
W
Typical Characteristics
(T
j
= 25
_
C unless otherwise specified)
r
f
– Differential Forward Resistance (
W
)
100
C
D
– Diode Capacitance ( pF )
f = 200 MHz
T
j
= 25°C
10
3.0
2.5
2.0
1.5
BA 682
1.0
0.5
0
0.1
94 9074
f = 100 MHz
T
j
= 25°C
BA 683
1
BA 683
BA 682
0.1
1
10
100
94 9075
0.1
1
10
100
I
F
– Forward Current ( mA )
V
R
– Reverse Voltage ( V )
Figure 1. Differential Forward Resistance vs. Forward Current
Figure 2. Diode Capacitance vs. Reverse Voltage
2 (4)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
BA682.BA683
Ozone Depleting Substances Policy Statement
It is the policy of
TEMIC TELEFUNKEN microelectronic GmbH
to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH
semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC
can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
4 (4)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
Microcontroller MCU
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