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Structure
Products
Type
Features
Silicon Monolithic IC
High side switch IC
BD2062FJ
Low on resistance 80mΩ MOSFET Switch
1A Continuous current load
Active “Low” control logic
Soft start circuit
Over current detection
Thermal shutdown
Under voltage lockout
Open drain error flag output
Reverse-current protection when power switch off
ESD protection
◇Absolute
maximum ratings
Parameter
Symbol
V
IN
V
/EN
V
/OC
IS
/OC
V
OUT
T
STG
Rating
-0.3 ~ 6.0
-0.3 ~ 6.0
-0.3 ~ 6.0
~ 5
-0.3 ~ 6.0
-55 ~ 150
Unit
V
V
V
mA
V
°C
mW
Supply voltage
/EN voltage
/OC voltage
/OC sink current
OUT voltage
Storage temperature
Power dissipation
675
*1
PD
*1 Mounted on 70mm*70mm*1.6mm glass-epoxy PCB. Derating : 5.4mW/°C above Ta=25°C.
* This product is not designed for protection against radioactive rays.
◇Operating
conditions
Parameter
Operating voltage
Operating temperature
Continuous output current
Symbol
V
IN
Min.
2.7
-40
0.0
Typ.
-
-
-
Max.
5.5
85
1.0
Unit
V
°C
A
T
OPR
I
OUT
REV. A
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◇Electric
characteristics
Unless otherwise specified V
IN
= 5.0V, Ta = 25°C
Parameter
Current consumption
Operating Current
Standby Current
I/O
V
/EN
/EN input voltage
V
/EN
/EN input current
/OC output LOW voltage
/OC output leak current
/OC delay time
Power switch
ON resistance
Current Limit Threshold
Short-circuit current
Output rise time
Output rise delay time
Output fall time
Output fall delay time
Switch leak current
Reverse leak current
UVLO
UVLO
Threshold
◇Measurement
circuit
V
IN
V
TUVH
V
TUVL
2.1
2.0
2.3
2.2
2.5
2.4
V
V
Increasing V
IN
Decreasing V
IN
R
ON
I
TH
I
SC
T
ON1
T
ON2
T
OFF1
T
OFF2
IL
SW
IL
REV
-
1.5
1.1
-
-
-
-
-
-
80
2.4
1.5
0.8
1.1
5
10
-
-
125
3.0
2.1
10
20
20
40
1.0
1.0
mΩ
A
A
ms
ms
μs
μs
μA
μA
V
OUT
= 0V, C
L
= 47μF
RMS
R
L
= 10Ω
R
L
= 10Ω
R
L
= 10Ω
R
L
= 10Ω
V
/EN
= 5V, V
OUT
= 0V
V
OUT
= 5.5V, V
IN
= 0V
I
OUT
= 500mA
I
/EN
V
/OCL
IL
/OC
T
/OC
-
-1.0
-
-
10
-
0.01
-
0.01
15
0.8
1.0
0.5
1
20
V
μA
V
μA
ms
Low input
V
/EN
= 0V or 5V
I
/OC
= 0.5mA
V
/OC
= 5V
2.0
-
-
V
High input
I
DD
I
STB
-
-
130
0.01
180
1
μA
μA
V
/EN
= 0V, OUT = OPEN
V
/EN
= 5V, OUT = OPEN
Symbol
Min.
Typ.
Max.
Unit
Condition
◇Timing
chart at output rise / fall time
T
OFF1
T
ON1
V
OUT
90%
10%
90%
10%
T
OFF2
A
IN
GND
V
/EN
/EN
/OC
V
/EN
OUT
R
L
A
C
L
I
OUT
T
ON2
50%
50%
REV. A
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◇Block
diagram
/EN1
Gate
Logic1
◇Package
/OC1
OCD1
Charge
pump1
TSD1
SW1
IN
UVLO
OUT1
D2062
/EN2
OCD2
Charge
pump2
SW2
OUT2
Lot No.
TSD2
Gate
Logic2
/OC2
GND
SOP-J8
(Unit : mm)
◇Pin
description
Pin No.
1
Pin Name
GND
Ground.
Power supply input.
2
IN
Input terminal to the power switch and power supply input
terminal of the internal circuit.
3
4
/EN1
/EN2
Enable input 1.
Power switch 1 on at Low level.
Enable input 2
Power switch 2 on at Low level.
Over current output 2.
5
/OC2
Low at over current, over-temperature detection.
Open drain output.
6
7
OUT2
OUT1
Power switch output 2.
Power switch output 1.
Over current output 1.
8
/OC1
Low at over current, over-temperature detection.
Open drain output.
Function
REV. A
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●Cautions
on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to
the interference by common impedance of layout pattern when there are plural power supplies and GND lines.
Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits,
separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power
supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of
the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is
not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
REV. A
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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