1/4
●
Structure
●
Product
●
Type
●
Features
Silicon Monolithic IC
High-Side Switch for Universal Serial Bus (USB)
BD2224G
Low On-Resistance (Typ. 150mΩ) N-channel MOSFET Built-in
500mA Continuous Load Current
Over-Current Protection
Thermal Shutdown
Open-Drain Fault Flag Output
Under-Voltage Lockout
Soft-Start Circuit
Input Voltage Range: 2.7V ~ 5.5V
Active-High Control Logic
SSOP5 Package
●
Absolute Maximum Ratings
(T
A
= 25
o
C)
Parameter
VIN Supply Voltage
EN Input Voltage
/OC Voltage
/OC Sink Current
VOUT Voltage
Storage Temperature
Power Dissipation
(*1)
Symbol
V
IN
V
EN
V
/OC
I
/OC
V
OUT
T
STG
P
D
Rating
-0.3 ~ 6.0
-0.3 ~ 6.0
-0.3 ~ 6.0
5
-0.3 ~ V
IN
+ 0.3
-55 ~ 150
675
o
o
Unit
V
V
V
mA
V
o
C
mW
(*1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1 C above 25 C.
●
Operating Conditions
Parameter
VIN Operating Voltage
Operating Temperature
Continuous Load Current
This IC is not designed to be radiation-proof.
Symbol
V
IN
T
OPR
I
OUT
Min.
2.7
-40
0
Typ.
5.0
-
-
Max.
5.5
85
500
Unit
V
o
C
mA
REV. B
2/4
●
Electrical Characteristics
V
IN
= 5V, T
A
= 25 C, unless otherwise specified.
o
DC Characteristics
Parameter
Operating Current
Standby Current
EN Input Voltage
EN Input Leakage
On-Resistance
Over-Current Threshold
Short Circuit Output Current
/OC Output Low Voltage
UVLO Threshold
Symbol
I
DD
I
STB
V
EN
V
EN
I
EN
R
ON
I
TH
I
SC
V
/OC
V
TUV
Min.
-
-
2.0
-
-1
-
550
350
-
2.1
2.0
Typ.
110
0.01
-
-
0.01
150
780
-
-
2.3
2.2
Max.
160
5
-
0.8
1
200
1000
-
0.4
2.5
2.4
Unit
μA
μA
V
V
μA
mΩ
mA
mA
V
V
V
Conditions
V
EN
= 5V, VOUT= open
V
EN
= 0V, VOUT= open
High input
Low input
V
EN
= 0V or 5V
I
OUT
= 50mA
V
OUT
= 0V, RMS
I
/OC
= 0.5mA
V
IN
increasing
V
IN
decreasing
AC Characteristics
Parameter
Turn-on Rise Time
Turn-on Delay Time
Turn-off Fall Time
Turn-off Delay Time
/OC Delay Time
Symbol
T
ON1
T
ON2
T
OFF1
T
OFF2
T
/OC
Min.
-
-
-
-
10
Typ.
1
1.5
1
3
15
Max.
6
10
20
40
20
Unit
ms
ms
μs
μs
ms
Conditions
R
L
= 20Ω
R
L
= 20Ω
R
L
= 20Ω
R
L
= 20Ω
●
Timing Chart
Over-Current
Detection
EN
50%
50%
Over-Current
Load Removed
VOUT
T
ON2
90%
T
OFF2
90%
10%
I
TH
I
OUT
I
SC
VOUT
10%
T
/OC
/OC
T
ON1
T
OFF1
Turn-on Time and Turn-off Time
Over-Current Protection
REV. B
3/4
●
Block Diagram
Over-Current
Protection
Under-Voltage
Lockout
EN
VIN
VOUT
Delay
Counter
Charge
Pump
Thermal
Shutdown
/OC
GND
●
Pin Description
Pin No.
1
2
3
Name
VIN
GND
EN
I/O
-
-
I
Function
Switch input and the supply voltage for the IC.
Ground.
Active-High enable input.
High level input turns on the switch.
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
Switch output.
4
5
/OC
VOUT
O
O
●
Package Outline
DA
Lot No.
Unit : mm
Drawing No. EX106-5001-2
Package : SSOP5
REV. B
4/4
●
Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode
exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including
the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the
interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when
there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND
pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no
problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating
or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (P
D
) in actual
states of use.
REV. B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
R0039A
京公网安备 11010802033920号
EEWORLD
