BD90C0AFPS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Power/power management> The power supply circuit> BD90C0AFPS

BD90C0AFPS: DescriptionLow ESR Capacitor, 1A Low Dropout Voltage Regulator; CategoryPower/power management The power supply circuit; File Size136KB，5 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

Download Datasheet Parametric View All

BD90C0AFPS Overview

Low ESR Capacitor, 1A Low Dropout Voltage Regulator

BD90C0AFPS Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	TO-252
package instruction	ROHS COMPLIANT, TO-252, 3 PIN
Contacts	4
Reach Compliance Code	compli
ECCN code	EAR99
Maximum drop-back voltage 1	0.5 V
Maximum input voltage	25 V
Minimum input voltage	10 V
JESD-30 code	R-PSSO-G2
JESD-609 code	e2
length	6.5 mm
Number of functions	1
Number of terminals	2
Working temperatureTJ-Max	105 °C
Operating temperatureTJ-Mi	-20 °C
Maximum output current 1	1 A
Maximum output voltage 1	9.09 V
Minimum output voltage 1	8.91 V
Nominal output voltage 1	9 V
Package body material	PLASTIC/EPOXY
encapsulated code	TO-252
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Regulator type	FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Maximum seat height	1.3 mm
surface mount	YES
Terminal surface	Tin/Copper (Sn/Cu)
Terminal form	GULL WING
Terminal pitch	2.3 mm
Terminal location	SINGLE
Maximum time at peak reflow temperature	10
width	5.5 mm

Preview

Download Datasheet

View All

1/4

STRUCTURE

PRODUCT SERIES

Silicon Monolithic Integrated Circuit

Low ESR Capacitor,

1A Low Dropout Voltage Regulator

ＢＤ９０Ｃ０ＡＦＰＳ

Output Current : 1A

High Output Voltage Precision :

±1％

High Input Voltage : 35V

TYPE

FEATURES

○ABSOLUTE

MAXIMUM RATINGS（Ta=25℃）

Parameter

Symbol

Limits

Unit

Supply Voltage

※1

Vcc

-0.3½+35.0

Power Dissipation

※2

1.2

Operating Temperature Range

Topr

-40½+105

℃

Storage Temperature Range

Tstg

-55½+150

℃

Maximum Junction Temperature

Tjmax

150

℃

※1

Not to exceed Pd.

※2

Reduced by 9.6mW / °C over Ta = 25°C, when mounted on glass epoxy board: 70mm×70mm×1.6mm.

○OPERATING

CONDITIONS（Ta=25℃）

Parameter

Supply Voltage

Output Current

Symbol

Vcc

Min.

10.0

Max.

25.0

1.0

Unit

Ｖ

NOTE : This product is not designed for protection against radioactive rays.

REV. A

3/4

○

BLOCK DIAGRAM

GND

FIN

○

Pin Number

Pin Name

Pin Number

VREF

：Bandgap

Reference

OCP

：Over

Current Protection Circuit

TSD

：Thermal

Shut Down Circuit

Driver

：Power

Transistor Driver

Pin Name

Function

Power Supply Pin

N.C. Pin

Output Pin

Vcc

N.C.

GND

VREF

Driver

OCP

TSD

FIN

GND

Vcc

N.C.

○Operation

Notes

1. Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the

IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If

operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to

eliminate the risk of damaging the IC.

2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and

other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.

3.GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage

below the GND at any time, regardless of transient characteristics.

4.Ground wiring pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single

ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the

GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick

as possible to reduce line impedance.

5.Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to

the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign

objects) may result in damage to the IC.

6.Operation in strong electromagnetic fields

Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong

electromagnetic fields may be present.

7.Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress.

Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely

before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground

the IC during assembly and use similar precautions during transport and storage.

8.Thermal consideration

Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.

Consider Pc that does not exceed Pd in actual operating conditions.

（Pd≧Pc）

Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,

θja

: Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],

Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current

Package Power dissipation : Pd (W)＝(Tjmax－Ta)／θja

Power dissipation

: Pc (W)＝(Vcc－Vo)×Io＋Vcc×Ib

9.Vcc pin

Insert a capacitor（capacitor≧1μF½） between the Vcc and GND pins. The appropriate capacitance value varies by application. Be

sure to allow a sufficient margin for input voltage levels.

REV. A

4/4

10.Output pins

It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable capacitance values

range from 1μF to 1000μF. Ceramic capacitors can be used as long as their ESR value is low enough to prevent oscillation (0.001Ω

to 20Ω). Abrupt fluctuations in input voltage and load conditions may affect the output voltage. Output capacitance values should

be determined only through sufficient testing of the actual application.

11.Over current protection circuit (OCP)

The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit

serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the

event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in

preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the

continuous or transitive operation of the protection circuits.

12.Thermal shutdown circuit (TSD)

The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload.

It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or

in applications where the operation of this circuit is assumed.

13.Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may

cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000μF or lower in case Vcc is shorted with

the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass

diodes between Vcc and each pin.

14.Positive voltage surges on VCC pin

A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V on the VCC

pin.

15.Negative voltage surges on VCC pin

A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin.

16. Output protection diode

Loads with large inductance components may cause reverse current flow during startup or shutdown.

diode should be inserted on the output to protect the IC.

In such cases, a protection

17.Regarding input pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN

junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors.

For example (refer to the figure below):

●When

GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode

●When

GND > Pin B, the PN junction operates as a parasitic transistor

Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference

among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a

voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.

Resistor

(Pin A)

(Pin B)

Transistor (NPN)

(Pin B)

GND

Parasitic elements

or transistors

P+

Parasitic elements

GND

P+

P substrate

Parasitic elements

or transistors

GND

(Pin A)

Parasitic elements

Example of Simple Monolithic IC Architecture

REV. A

Notice

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the specifications,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products specified in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, office-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products specified in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, fire or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specified herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039A

Recommended Resources

μPC1321V power amplifier circuit diagram

500V trigger circuit

Electronic two-tone metronome circuit

Non-isolated thyristor switching power supply

875p computer motherboard circuit diagram_027

Computer motherboard circuit diagram 820 1_57

dsp28335ecap: I have a question. Do the 4 triggers CEVT1 CEVT2 CEVT3 CEVT4 need to connect the same signal to four ECAP pins (my photoelectric encoder has only one signal output). If it is one PWM, it needs to conn...; tanying41 TI Technology Forum

Foreign man hits old lady and the ending is disappointing: [Foreigner who knocked down an old lady in Beijing will be deported] [b] The foreign man committed traffic violations such as driving without a license, driving without a license plate, carrying passe...; walkwk Talking

Sporadic exams: I just finished another exam, haha, there are still four subjects to go. The interruptions between these exams are too severe, so it’s quite relaxing haha:lol :lol :lol :lol...; 鑫海宝贝 Talking

The protagonists of video surveillance systems in 2010: five technologies: With the acceleration of the networking process, the future development direction of video surveillance is becoming clearer and clearer: first, the continuous improvement of user experience, and secon...; xyh_521 Industrial Control Electronics

Calibration/calibration of medical device products: Calibration/calibration of medical device products1. Calibration is not the same as calibration, and it is not to be calibrated by a metrology institute or a third party! 2. How to calibrate in vitro ...; QWE4562009 Medical Electronics

UPS power supply selection and battery capacity calculation: [align=left][b]Foreword: How to choose UPS power supply in weak current system? There are so many brands on the market, which one should we choose? How to match the battery? [/b] [b] Text: [/b] [b]1. ...; 木犯001号 Power technology

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components