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BA423AL135

Description
DIODE SILICON, MIXER DIODE, Microwave Mixer Diode
CategoryDiscrete semiconductor    diode   
File Size65KB,2 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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BA423AL135 Overview

DIODE SILICON, MIXER DIODE, Microwave Mixer Diode

BA423AL135 Parametric

Parameter NameAttribute value
MakerNXP
package instructionO-LELF-R2
Reach Compliance Codeunknown
ECCN codeEAR99
Minimum breakdown voltage20 V
Shell connectionISOLATED
ConfigurationSINGLE
Maximum diode capacitance2.5 pF
Diode component materialsSILICON
Diode typeMIXER DIODE
Maximum forward voltage (VF)0.9 V
JESD-30 codeO-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Maximum output current50 A
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Maximum power dissipation0.21 W
Certification statusNot Qualified
Maximum reverse current0.1 µA
surface mountYES
Terminal formWRAP AROUND
Terminal locationEND

BA423AL135 Related Products

BA423AL135 BA423AL112 BA423AL115
Description DIODE SILICON, MIXER DIODE, Microwave Mixer Diode DIODE SILICON, MIXER DIODE, Microwave Mixer Diode DIODE SILICON, MIXER DIODE, Microwave Mixer Diode
Maker NXP NXP NXP
package instruction O-LELF-R2 O-LELF-R2 O-LELF-R2
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Minimum breakdown voltage 20 V 20 V 20 V
Shell connection ISOLATED ISOLATED ISOLATED
Configuration SINGLE SINGLE SINGLE
Maximum diode capacitance 2.5 pF 2.5 pF 2.5 pF
Diode component materials SILICON SILICON SILICON
Diode type MIXER DIODE MIXER DIODE MIXER DIODE
Maximum forward voltage (VF) 0.9 V 0.9 V 0.9 V
JESD-30 code O-LELF-R2 O-LELF-R2 O-LELF-R2
Number of components 1 1 1
Number of terminals 2 2 2
Maximum operating temperature 150 °C 150 °C 150 °C
Maximum output current 50 A 50 A 50 A
Package body material GLASS GLASS GLASS
Package shape ROUND ROUND ROUND
Package form LONG FORM LONG FORM LONG FORM
Maximum power dissipation 0.21 W 0.21 W 0.21 W
Certification status Not Qualified Not Qualified Not Qualified
Maximum reverse current 0.1 µA 0.1 µA 0.1 µA
surface mount YES YES YES
Terminal form WRAP AROUND WRAP AROUND WRAP AROUND
Terminal location END END END
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