EEWORLDEEWORLDEEWORLD

Part Number

Search

46226-25/BXAJC

Description
MEMORY MODULE,SRAM,128KX32,HYBRID,DIP,68PIN,CERAMIC
Categorystorage    storage   
File Size143KB,2 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

46226-25/BXAJC Overview

MEMORY MODULE,SRAM,128KX32,HYBRID,DIP,68PIN,CERAMIC

46226-25/BXAJC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionDIP, DIP68(UNSPEC)
Reach Compliance Codeunknown
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T68
JESD-609 codee0
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP68(UNSPEC)
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Minimum standby current4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyHYBRID
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal locationDUAL

46226-25/BXAJC Related Products

46226-25/BXAJC 46226-30/BXAJC 46226-30/BYAJC 46226-45/BXAJC
Description MEMORY MODULE,SRAM,128KX32,HYBRID,DIP,68PIN,CERAMIC MEMORY MODULE,SRAM,128KX32,HYBRID,DIP,68PIN,CERAMIC MEMORY MODULE,SRAM,128KX32,HYBRID,SO,68PIN,CERAMIC MEMORY MODULE,SRAM,128KX32,HYBRID,DIP,68PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker NXP NXP NXP NXP
package instruction DIP, DIP68(UNSPEC) DIP, DIP68(UNSPEC) SOP, SO68(UNSPEC) DIP, DIP68(UNSPEC)
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 25 ns 30 ns 30 ns 45 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-XDIP-T68 R-XDIP-T68 R-XDSO-G68 R-XDIP-T68
JESD-609 code e0 e0 e0 e0
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32
Number of terminals 68 68 68 68
word count 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 128KX32 128KX32 128KX32 128KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP SOP DIP
Encapsulate equivalent code DIP68(UNSPEC) DIP68(UNSPEC) SO68(UNSPEC) DIP68(UNSPEC)
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO YES NO
technology HYBRID HYBRID HYBRID HYBRID
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2732  1378  2428  434  41  55  28  49  9  1 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号