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IDT7281L15PAGI8

Description
FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO56, TSSOP-56
Categorystorage    storage   
File Size283KB,12 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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IDT7281L15PAGI8 Overview

FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO56, TSSOP-56

IDT7281L15PAGI8 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeTSSOP
package instructionTSSOP,
Contacts56
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time15 ns
Other featuresRETRANSMIT
period time25 ns
JESD-30 codeR-PDSO-G56
JESD-609 codee3
length14 mm
memory density4608 bit
memory width9
Humidity sensitivity level1
Number of functions2
Number of terminals56
word count512 words
character code512
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X9
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width6.1 mm
CMOS DUAL ASYNCHRONOUS FIFO
DUAL 256 x 9, DUAL 512 x 9,
DUAL 1,024 x 9, DUAL 2,048 x 9,
DUAL 4,096 x 9, DUAL 8,192 x 9
IDT7280
IDT7281
IDT7282
IDT7283
IDT7284
IDT7285
FEATURES:
DESCRIPTION:
The IDT7280 is equivalent to two IDT7200 256 x 9 FIFOs
The IDT7281 is equivalent to two IDT7201 512 x 9 FIFOs
The IDT7282 is equivalent to two IDT7202 1,024 x 9 FIFOs
The IDT7283 is equivalent to two IDT7203 2,048 x 9 FIFOs
The IDT7284 is equivalent to two IDT7204 4,096 x 9 FIFOs
The IDT7285 is equivalent to two IDT7205 8,192 x 9 FIFOs
Low power consumption
— Active: 685 mW (max.)
— Power-down: 83 mW (max.)
Ultra high speed—12 ns access time
Asynchronous and simultaneous read and write
Offers optimal combination of data capacity, small foot print
and functional flexibility
Ideal for bi-directional, width expansion, depth expansion,
bus-matching, and data sorting applications
Status Flags: Empty, Half-Full, Full
Auto-retransmit capability
High-performance CMOS technology
Space-saving TSSOP
Industrial temperature range (–40°C to +85°C) is available
°
°
The IDT7280/7281/7282/7283/7284/7285 are dual-FIFO memories that
load and empty data on a first-in/first-out basis. These devices are functional
and compatible to two IDT7200/7201/7202/7203/7204/7205 FIFOs in a single
package with all associated control, data, and flag lines assigned to separate
pins. The devices use Full and Empty flags to prevent data overflow and
underflow and expansion logic to allow for unlimited expansion capability in both
word size and depth.
The reads and writes are internally sequential through the use of ring pointers,
with no address information required to load and unload data. Data is toggled
in and out of the devices through the use of the Write (W) and Read (R) pins.
The devices utilize a 9-bit wide data array to allow for control and parity bits
at the user’s option. This feature is especially useful in data communications
applications where it is necessary to use a parity bit for transmission/reception
error checking. It also features a Retransmit (RT) capability that allows for reset
of the read pointer to its initial position when
RT
is pulsed LOW to allow for
retransmission from the beginning of data. A Half-Full Flag is available in the
single device mode and width expansion modes.
These FIFOs are fabricated using high-speed CMOS technology. They are
designed for those applications requiring asynchronous and simultaneous
read/writes in multiprocessing and rate buffer applications.
FUNCTIONAL BLOCK DIAGRAM
DATA INPUTS
(DA
0
-DA
8
)
WA
WRITE
CONTROL
WRITE
POINTER
THREE-
STATE
BUFFERS
RAM
ARRAY A
256 x 9
512 x 9
1,024 x 9
2,048 x 9
4,096 x 9
8,192 x 9
RSA
WB
WRITE
CONTROL
WRITE
POINTER
DATA INPUTS
(DB
0
-DB
8
)
RAM
ARRAY B
256 x 9
512 x 9
1,024 x 9
2,048 x 9
4,096 x 9
8,192 x 9
THREE-
STATE
BUFFERS
RSB
READ
POINTER
READ
POINTER
RA
READ
CONTROL
FLAG
LOGIC
EXPANSION
LOGIC
RESET
LOGIC
READ
CONTROL
FLAG
LOGIC
EXPANSION
LOGIC
RESET
LOGIC
XIA
XOA/HFA
FFA
EFA
DATA
OUTPUTS
(QA
0
-QA
8
)
FLA/RTA
RB
XIB
XOB/HFB
FFB
EFB
DATA
OUTPUTS
(QB
0
-QB
8
)
FLB/RTB
3208 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2012
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2012
DSC-3208/9

IDT7281L15PAGI8 Related Products

IDT7281L15PAGI8 IDT7283L12PAG8 IDT7285L12PAG8 IDT7285L12PAG IDT7281L12PAG IDT7285L15PAGI IDT7285L15PAGI8 IDT7281L12PAG8 IDT7281L15PAGI
Description FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO56, TSSOP-56 FIFO, 2KX9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56 FIFO, 8KX9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56 FIFO, 8KX9, 12ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 FIFO, 512X9, 12ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDSO56, TSSOP-56 FIFO, 512X9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56 FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
package instruction TSSOP, TSSOP, TSSOP, TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20 TSSOP, TSSOP, TSSOP, TSSOP56,.3,20
Contacts 56 56 56 56 56 56 56 56 56
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 15 ns 12 ns 12 ns 12 ns 12 ns 15 ns 15 ns 12 ns 15 ns
Other features RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
period time 25 ns 20 ns 20 ns 20 ns 20 ns 25 ns 25 ns 20 ns 25 ns
JESD-30 code R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e3
length 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
memory density 4608 bit 18432 bit 73728 bit 73728 bit 4608 bit 73728 bit 73728 bit 4608 bit 4608 bit
memory width 9 9 9 9 9 9 9 9 9
Humidity sensitivity level 1 1 1 1 1 1 1 1 1
Number of functions 2 2 2 1 1 1 2 2 1
Number of terminals 56 56 56 56 56 56 56 56 56
word count 512 words 2048 words 8192 words 8192 words 512 words 8192 words 8192 words 512 words 512 words
character code 512 2000 8000 8000 512 8000 8000 512 512
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C
organize 512X9 2KX9 8KX9 8KX9 512X9 8KX9 8KX9 512X9 512X9
Exportable NO NO NO NO NO NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30 30
width 6.1 mm 6.1 mm 6.1 mm 6.1 mm 6.1 mm 6.1 mm 6.1 mm 6.1 mm 6.1 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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