datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Discrete semiconductor> diode> BAV303
PDF
Preview

BAV303

Description
Rectifier Diode, 1 Element, 0.25A, 200V V(RRM), Silicon, HERMETIC SEALED, MICROMELF-2
CategoryDiscrete semiconductor    diode   
File Size636KB，3 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric Compare View All

BAV303 Overview

Rectifier Diode, 1 Element, 0.25A, 200V V(RRM), Silicon, HERMETIC SEALED, MICROMELF-2

BAV303 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum output current0.25 A
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum repetitive peak reverse voltage200 V
Maximum reverse recovery time0.05 µs
surface mountYES
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature30

Preview

Download Datasheet
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
BAV300
THRU
BAV303
Features
•
•
•
•
•
Saving Space
Silicon Epitaxial Planar Diodes
Hermetic Sealed Parts
Fits onto SOD-323/SOT-23 footprints
Electrical data identical with the devices BAV100…BAV103
Switching Diodes
Maximum Ratings
Continuous Reverse
Voltage
BAV300
BAV301
BAV302
BAV303
Repetitive Peak Reverse
Voltage
BAV300
BAV301
BAV302
BAV303
Forward DC Current
Repetitive Peak Forward
Current
Surge Forward Current
Thermal Resistance
Junction to Ambient
Junction temperature
Storage temperature Range
MICROMELF
50V
100V
150V
200V
60V
120V
200V
250V
250mA
625mA
1.0A
500K/W
175℃
-65 to + 175℃
2
V
R
T
A
=25℃
Cathode Mark
T
A
=25℃
V
RRM
I
F
I
FRM
I
FSM
R
thJA
T
j
T
stg
T
A
=25℃
f=50Hz, T
A
=25℃
T
P
=1s, T
j
=25℃
Note (1)
C
B
A
Note: (1) mounted on epoxy-glass hard tissue, Fig.4 35μm copper clad, 0.9 mm
copper area per electrode
Maximum Forward Voltage
V
F
Maximum Leakage current
BAV300
BAV300
BAV301
BAV301
BAV302
BAV302
BAV303
BAV303
Maximum Leakage current
BAV300
BAV301
BAV302
BAV303
Diode Capacitance
Maximum Reverse recovery
time
Differential Forward
Resistance
1.00V
100nA
15μA
100nA
15μA
100nA
15μA
100nA
15μA
60V
120V
200V
250V
1.5pF
50ns
5.0
Ω
Electrical Characteristics @ 25°C Unless Otherwise Specified
I
F
= 100mA ,T
A
=25℃
V
R
=50V
V
R
=50V, Tj=100℃
V
R
=100V
V
R
=100V, Tj=100℃
V
R
=150V
V
R
=150V, Tj=100℃
V
R
=200V
V
R
=200V, Tj=100℃
I
R
=100μA, tP/T=0.01,
tP=0.3ms
DIM
A
B
C
DIMENSIONS
INCHES
MIN
.071
.004
.047
MAX
.079
.008
.051
MIN
1.8
.10
1.20
MM
MAX
2.0
.20
1.30
NOTE
∅
I
R
SUGGESTED SOLDER
PAD LAYOUT
0.039
V
(BR)
0.055”
C
D
t
rr
r
F
V
R
=0V, f=1.0MHz
I
F
=10mA, I
R
=30mA
I
rr
=3.0mA, R
L
=100Ω
0.030”
I
F
=10mA
Revision: 3
www.mccsemi.com
1 of 3
2006/05/28

BAV303 Related Products

BAV303 BAV301 BAV301P BAV300 BAV300P BAV302 BAV302P BAV303P
Description Rectifier Diode, 1 Element, 0.25A, 200V V(RRM), Silicon, HERMETIC SEALED, MICROMELF-2 Rectifier Diode, 1 Element, 0.25A, 120V V(RRM), Silicon, HERMETIC SEALED, MICROMELF-2 DIODE 0.25 A, 120 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, MICROMELF-2, Signal Diode Rectifier Diode, 1 Element, 0.25A, 60V V(RRM), Silicon, HERMETIC SEALED, MICROMELF-2 DIODE 0.25 A, 60 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, MICROMELF-2, Signal Diode Rectifier Diode, 1 Element, 0.25A, 150V V(RRM), Silicon, HERMETIC SEALED, MICROMELF-2 DIODE 0.25 A, 150 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, MICROMELF-2, Signal Diode DIODE 0.25 A, 200 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, MICROMELF-2, Signal Diode
Is it lead-free? Contains lead Contains lead Lead free Contains lead Lead free Contains lead Lead free Lead free
Is it Rohs certified? incompatible incompatible conform to incompatible conform to incompatible conform to conform to
Maker Micro Commercial Components (MCC) Micro Commercial Components (MCC) Micro Commercial Components (MCC) Micro Commercial Components (MCC) Micro Commercial Components (MCC) Micro Commercial Components (MCC) Micro Commercial Components (MCC) Micro Commercial Components (MCC)
Parts packaging code MELF MELF MELF MELF MELF MELF MELF MELF
package instruction O-LELF-R2 HERMETIC SEALED, MICROMELF-2 HERMETIC SEALED, MICROMELF-2 O-LELF-R2 HERMETIC SEALED, MICROMELF-2 HERMETIC SEALED, MICROMELF-2 HERMETIC SEALED, MICROMELF-2 HERMETIC SEALED, MICROMELF-2
Contacts 2 2 2 2 2 2 2 2
Reach Compliance Code compliant compliant unknown compliant unknown compliant unknown unknown

Recommended Resources

Some brief summaries on power MOSFET applications, you deserve them

Mobile phone charger power conversion circuit diagram

DC-DC converter circuit diagram composed of LT1072

3KHZ notch filter circuit diagram

Charging circuit composed of LP3945

Computer motherboard circuit diagram 810 2_17

ARM assembly error Bad or unknown attribute, please tell me how to fix it, the code is as follows
COUNT EQU 0x40003100 AREA EXAMPLE2,CODE,ERADONLY ENTRY NOD END The error occurs in the line where the code segment is declared...
zhang_shuai2005 ARM Technology
TI sensor monitor cannot display topology
The serial port can be connected. The middle circle shows SINK NO RESP and the bottom shows Connected but no response. I searched online and someone said that the coordinator needs to add the compilat...
Shakeel RF/Wirelessly
Newbie's question about avr, really want to ask for advice, functions, programming skills
Thank you. Please read this avr studio compilation software used by avr tiny24 for the first time after graduation. There are many things I don't understand. I hope the teachers can answer them if the...
07031529 Microchip MCU
About USB mobile hard disk programming problem, how to know the drive letter of a mobile hard disk
I would like to ask a programming question about USB mobile hard disks. How to know the drive letter of a mobile hard disk? Scenario: A mobile hard disk box with a known VendorID and ProductID is plug...
sanfutan Embedded System
【ST NUCLEO-H743ZI Review】+ USB OTG+FATFS
[i=s]This post was last edited by sylar^z on 2020-5-19 00:38[/i]The NUCLEO-H743ZI board has its own USB interface, which can be used as a device USB port or as a main USB port to connect external USB ...
sylar^z stm32/stm8
I want to output the sound from iPod to our own device through the Dock interface. Does anyone have relevant information?
I want to output the sound from iPod to our own device through the Dock interface. Does anyone have relevant information?...
ele Embedded System
Shortcut:   00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components

  1. 17S223KLF
  2. M85049-1809W03A
  3. MXSMBJ4734DGE3TR
  4. HW-07-17-G-D-775-SM
  5. TC1313-RG3EUNTR
  6. RCMT0527101DDS03
  7. USS2-T2204.22KOHMS0.01%3PPM
  8. RNR70K2712DP
  9. AME8500BEEVCA29
  10. AME8501CEFTDD21
  11. A3502H-3P
  12. D1272H-24P-10

Popular Articles

  1. ST monolithic GaN gate drivers accelerate industrial and home automation and increase flexibility
  2. About earphone customization - audiometry and ergonomics (Part 2)
  3. Thermal expansion valve failure phenomenon_difference between internal and external balance of thermal expansion valve
  4. 51 single chip microcomputer simulation - alarm and rotating light
  5. Renesas Electronics targets the evolving small form factor applications in next-generation electrical and electronic architectures
  6. NVIDIA Delivers Powerful Perception Deep Neural Networks to AI-Assisted Driving Platform
  7. The foldable screen is just one of the three reasons why you must buy OPPO Find N
  8. How to Design HVAC Systems for Hybrid/Electric Vehicles
  9. Huawei will launch a domestically developed browser kernel
  10. The 1.06 billion yuan Qizhong advanced packaging and testing production base project settled in Hefei and will start construction next year

Technical ResourceMore

  1. Design of high-level class D power amplifier integrated circuit
  2. Zero Voltage Switching Multi-Resonant Three-Level DC-DC Converter
  3. New automotive electronics technology
  4. Connecting devices - Safety requirements for threaded and threadless clamps for electrical copper conductors
  5. Common knowledge documents for digital IC circuit design written test and interview
  6. ascii quick search tool
  7. How to use long integer variables in COSMIC
  8. Altium-Common 3D package library (Step) [Common patch] SW-QZ-6x6dip.rar
  9. Application of Flat Matrix Transformer in Switching Power Supply
  10. Introduction to switching power supply design knowledge

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 2077  32  1559  109  1222  42  1  32  3  25 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号