HM4-65162-9 datasheet, PDF - EEWORLD Datasheet

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HM4-65162-9: Description2KX8 STANDARD SRAM, 90ns, CQCC32; Categorystorage storage; File Size43KB，7 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HM4-65162-9 Overview

2KX8 STANDARD SRAM, 90ns, CQCC32

HM4-65162-9 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	QFJ
package instruction	CERAMIC, LCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	90 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.00004 A
Minimum standby current	2 V
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

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HM-65162

March 1997

2K x 8 Asynchronous

CMOS Static RAM

Description

The HM-65162 is a CMOS 2048 x 8 Static Random Access

Memory manufactured using the Intersil Advanced SAJI V

process. The device utilizes asynchronous circuit design for

fast cycle time and ease of use. The pinout is the JEDEC 24

pin DIP, and 32 pad 8-bit wide standard which allows easy

memory board layouts ﬂexible to accommodate a variety of

industry standard PROMs, RAMs, ROMs and EPROMs. The

HM-65162 is ideally suited for use in microprocessor based

systems with its 8-bit word length organization. The conve-

nient output enable also simpliﬁes the bus interface by allow-

ing the data outputs to be controlled independent of the chip

enable. Gated inputs lower operating current and also elimi-

nate the need for pull-up or pull-down resistors.

Features

• Fast Access Time. . . . . . . . . . . . . . . . . . . . 70/90ns Max

• Low Standby Current. . . . . . . . . . . . . . . . . . . .50µA Max

• Low Operating Current . . . . . . . . . . . . . . . . . 70mA Max

• Data Retention at 2.0V . . . . . . . . . . . . . . . . . . .20µA Max

• TTL Compatible Inputs and Outputs

• JEDEC Approved Pinout (2716, 6116 Type)

• No Clocks or Strobes Required

• Equal Cycle and Access Time

• Single 5V Supply

• Gated Inputs

• No Pull-Up or Pull-Down Resistors Required

Ordering Information

PACKAGE

CERDIP

JAN#

SMD#

CLCC

SMD#

NOTE:

1. Access time/data retention supply current.

TEMP. RANGE

-40

C to +85

-55

C to +125

-55

C to +125

-40

C to +85

-55

C to 125

70ns/20µA

(NOTE 1)

HM1-65162B-9

29110BJA

8403606JA

HM4-65162B-9

8403606ZA

90ns/40µA

(NOTE 1)

HM1-65162-9

29104BJA

8403602JA

HM4-65162-9

8403602ZA

8403603JA

HM4-65162C-9

8403603ZA

90ns/300µA

(NOTE 1)

HM1-65162C-9

PKG. NO.

F24.6

J32.A

Pinouts

HM-65162

(CERDIP)

TOP VIEW

HM-65162

(CLCC)

TOP VIEW

29 A8

28 A9

27 NC

26 W

25 G

24 A10

23 E

22 DQ7

21 DQ6

DESCRIPTION

No Connect

Address Input

Chip Enable/Power Down

Ground

Data In/Data Out

Power (+5V)

Write Enable

Output Enable

DQ0

24 V

23 A8

22 A9

21 W

20 G

19 A10

18 E

17 DQ7

16 DQ6

15 DQ5

14 DQ4

13 DQ3

A0 - A10

/GND

DQ0 - DQ7

A1 10

A0 11

NC 12

DQ0

DQ1

15 16

DQ2

GND

DQ3

DQ4

DQ5

DQ1 10

DQ2 11

GND 12

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

http://www.intersil.com or 407-727-9207

Intersil Corporation 1999

File Number

3000.1

6-1

HM4-65162-9 Related Products

	HM4-65162-9	29104BJA	HM4-65162C-9	8403603ZA	8403606ZA
Description	2KX8 STANDARD SRAM, 90ns, CQCC32	2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24	2KX8 STANDARD SRAM, 90ns, CQCC32	2KX8 STANDARD SRAM, 90ns, CQCC32, CERAMIC, CC-32	2KX8 STANDARD SRAM, 70ns, CQCC32, CERAMIC, CC-32
Parts packaging code	QFJ	DIP	QFJ	QFN	QFJ
package instruction	CERAMIC, LCC-32	CERAMIC, DIP-24	CERAMIC, LCC-32	QCCN,	QCCN,
Contacts	32	24	32	32	32
Reach Compliance Code	not_compliant	_compli	not_compliant	unknown	unknown
ECCN code	EAR99	3A001.A.2.C	EAR99	3A001.A.2.C	3A001.A.2.C
Maximum access time	90 ns	90 ns	90 ns	90 ns	70 ns
JESD-30 code	R-CQCC-N32	R-GDIP-T24	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32
memory density	16384 bit	16384 bi	16384 bit	16384 bit	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	32	24	32	32	32
word count	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-55 °C	-55 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DIP	QCCN	QCCN	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	QUAD	QUAD	QUAD
Is it Rohs certified?	incompatible	incompatible	incompatible	-	-
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
JESD-609 code	e0	e0	e0	-	-
Terminal surface	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)	-	-
Maximum seat height	-	5.72 mm	-	3.05 mm	3.05 mm
width	-	15.24 mm	-	11.43 mm	11.43 mm

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