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5962-9315708HXX

Description
SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Categorystorage    storage   
File Size117KB,4 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9315708HXX Overview

SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32

5962-9315708HXX Parametric

Parameter NameAttribute value
MakerWhite Electronic Designs Corporation
package instruction0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Codeunknown
Maximum access time25 ns
Other featuresBATTERY BACK-UP OPERATION
JESD-30 codeR-CDIP-T32
length42.4 mm
memory density2097152 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
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