IDT71V016SA12BF8 datasheet, PDF

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IDT71V016SA12BF8: DescriptionStandard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48; Categorystorage storage; File Size99KB，9 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT71V016SA12BF8 Overview

Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48

IDT71V016SA12BF8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	LFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	12 ns
I/O type	COMMON
JESD-30 code	S-PBGA-B48
JESD-609 code	e0
length	7 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.34 mm
Maximum standby current	0.01 A
Minimum standby current	3.15 V
Maximum slew rate	0.15 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	7 mm

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3.3V CMOS Static RAM

1 Meg (64K x 16-Bit)

Features

IDT71V016SA

Description

The IDT71V016 is a 1,048,576-bit high-speed Static RAM organized

as 64K x 16. It is fabricated using IDT’s high-perfomance, high-reliability

CMOS technology. This state-of-the-art technology, combined with inno-

vative circuit design techniques, provides a cost-effective solution for high-

speed memory needs.

The IDT71V016 has an output enable pin which operates as fast

as 5ns, with address access times as fast as 10ns. All bidirectional

inputs and outputs of the IDT71V016 are LVTTL-compatible and operation

is from a single 3.3V supply. Fully static asynchronous circuitry is used,

requiring no clocks or refresh for operation.

The IDT71V016 is packaged in a JEDEC standard 44-pin Plastic

SOJ, a 44-pin TSOP Type II, and a 48-ball plastic 7 x 7 mm FBGA.

64K x 16 advanced high-speed CMOS Static RAM

Equal access and cycle times

— Commercial: 10/12/15/20ns

— Industrial: 12/15/20ns

One Chip Select plus one Output Enable pin

Bidirectional data inputs and outputs directly

LVTTL-compatible

Low power consumption via chip deselect

Upper and Lower Byte Enable Pins

Single 3.3V power supply

Available in 44-pin Plastic SOJ, 44-pin TSOP, and

48-Ball Plastic FBGA packages

Functional Block Diagram

Output

Enable

Buffer

– A

Address

Buffers

Row / Column

Decoders

I/O

Chip

Enable

Buffer

Sense

Amps

and

Write

Drivers

Low

Byte

I/O

Buffer

High

Byte

I/O

Buffer

I/O

Write

Enable

Buffer

64K x 16

Memory

Array

I/O

BHE

Byte

Enable

Buffers

BLE

3834 drw 01

JUNE 2002

DSC-3834/06

IDT71V016SA12BF8 Related Products

	IDT71V016SA12BF8	IDT71V016SA15BF8	IDT71V016SA20BF8	IDT71V016SA10BF8	IDT71V016SA20BFI8	IDT71V016SA15BFI8	IDT71V016SA12BFI8
Description	Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 15ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 10ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 15ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30
Contacts	48	48	48	48	48	48	48
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	12 ns	15 ns	20 ns	10 ns	20 ns	15 ns	12 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16	16
Humidity sensitivity level	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1
Number of terminals	48	48	48	48	48	48	48
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	85 °C	85 °C	85 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.34 mm	1.34 mm	1.34 mm	1.34 mm	1.34 mm	1.34 mm	1.34 mm
Maximum standby current	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
Minimum standby current	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Maximum slew rate	0.15 mA	0.13 mA	0.12 mA	0.16 mA	0.12 mA	0.13 mA	0.16 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3.15 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	20	20	20	20	20	20
width	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Base Number Matches	-	1	1	1	1	1	-

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