Multilayer NTC Thermistors
Multilayer NTC Thermistors
Series:
ERTJ
●
●
●
●
●
■
Features
Surface Mount Device (0201, 0402, 0603)
Highly reliable multilayer / monolithic structure
Wide temperature operating range (–40 to 125 °C)
Environmentally-friendly lead-free
RoHS compliant
■
Recommended Applications
●
Mobile Phone
· Temperature compensation for crystal oscillator
· Temperature compensation for semiconductor
devices
●
Personal Computer
· Temperature detection for CPU and memory device
· Temperature compensation for ink-viscosity
(Inkjet Printer)
●
Battery Pack
· Temperature detection of battery cells
●
Liquid Crystal Display
· Temperature compensation of display contrast
· Temperature compensation of display backlighting
(CCFL)
■
Handling Precautions
See Page 158 to 162
■
Packaging Specifications
See Page 151, 163
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
T
J
0
E
G
1
0
3
J
A
(Example)
Common Code
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
Size Code
Z “0201”
0 “0402”
1 “0603”
Packaging
Style Code
E
“0201”, “0402”
Paper Taping
(Pitch : 2 mm)
“0603”
Punched carrier
Paper Taping
(Pitch : 4 mm)
V
B Value Class Code
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
Nominal Resistance
R
25
( )
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
Resistance Tolerance
Code
F
G
H
J
±1%
Narrow
Tolerance
±2%
Type
±3%
Standard
±5%
Type
Special
Specification
■
Construction
No
A
B
3
4
5
1
2
Name
Semiconductive Ceramics
Internal electrode
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
C
D
E
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Dec. 2008
– EC150 –
Multilayer NTC Thermistors
■
Dimensions in mm (not to scale)
L
(Unit : mm)
W
Size Code (EIA)
Z(0201)
0(0402)
L
0.60±0.03
1.0±0.1
1.60±0.15
W
0.30±0.03
0.50±0.05
0.8±0.1
T
0.30±0.03
0.50±0.05
0.8±0.1
L
1
, L
2
0.15±0.05
0.25±0.15
0.3±0.2
T
1(0603)
L
1
L
2
■
Packaging Specifications
Style
Size Code
Thickness
●
Standard Packing Quantities
Paper taping
Pitch 2 mm: 15000 pcs./reel
Pitch 2 mm: 10000 pcs./reel
Pitch 4 mm: 4000 pcs./reel
●
Reel for Taping
W
1
E
C
B
Z(0201)
0(0402)
1(0603)
0.3 mm
0.5 mm
0.8 mm
D
●
Paper Taping
Pitch 2 mm (Pressed Carrier taping) : 0201
t
Feeding hole
φD
0
Chip pocket
W
2
A
E
Symbol
Dim.
(mm)
K
0
Symbol
Chip component
B
P
1
P
2
P
0
Tape running direction
F
W
A
φA
0
φB
C
D
E
W
1
W
2
180
–3
60.0
+1.0
13.0
±0.5
21.0
±0.8
2.0
±0.5
9.0
+1.0
11.4
±1.0
0
0
A
B
W
F
E
P
1
P
2
P
0
φD
0
0
t
K
0
Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5
+0.1
0.55 0.36
(mm)
±0.03 ±0.03 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
max. ±0.03
●
Leader Part and Taped End
Leader part
Top cover tape
Pitch 2 mm (Punched Carrier taping) : 0402
t
1
Feeding hole
φD
0
Chip pocket
100 min.
Vacant position
400 min.
E
B
F
W
A
Taped end
t
2
Symbol
Chip component
P
1
P
2
P
0
Tape running direction
160 min.
Vacant position
(Unit : mm)
A
B
W
F
E
P
1
P
2
P
0
φD
0
0
t
1
t
2
1.0
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5
+0.1
0.7
(mm)
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
max. max.
●
See page 163 for Packaging Informations
Pitch 4 mm (Punched Carrier taping) : 0603
t
1
Feeding hole
φD
0
A
B
F
W
Chip pocket
t
2
Symbol
Chip component
P
1
P
2
P
0
Tape running direction
A
±0.1
B
±0.1
W
F
E
P
1
P
2
P
0
φD
0
0
E
t
1
t
2
1.4
Dim. 1.0
(mm)
1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5
+0.1
1.1
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
max. max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Dec. 2008
– EC151 –
Multilayer NTC Thermistors
■
Ratings
Size code (EIA)
Operating
Temperature Range
Rated Maximum
Power Dissipation
½1
Heat Dissipation Constant
½2
Z(0201)
0(0402)
–40 to 125 °C
33 mW
approximately
1 mW/°C
66 mW
approximately
2 mW/°C
100 mW
approximately
3 mW/°C
1(0603)
½1
Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The Maximum Power Dissipation under ambient temperature 25 °C or less is the same with the rated maximum power dissipation, and Maximum
power dissipation beyond 25 °C depends on the Decreased power dissipation curve.
· Please see “Operating Power” for details paging 158.
½2
Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under
stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
●
Resistance ratios to R
25
at each temperature/Reference values
(for obtaining resistance at each temperature by using R
25
shown in part number)
ERTJ
A
ERTJ G ERTJ M ERTJ P ERTJ R ERTJ S
B
25/50
2750 K
2800 K
(3375 K)
3900 K
4050 K
4250K
(4330K)
3435 K
(3970 K) (4100 K)
(4300K)
4390K
B
25/85
(2700 K) (2750 K)
T(°C)
-40 13.05
13.28
20.52
32.11
33.10
43.10
45.53
-35 10.21
10.40
15.48
23.29
24.03
30.45
31.99
-30 8.061
8.214
11.79
17.08
17.63
21.76
22.74
-25 6.427
6.547
9.069
12.65
13.06
15.73
16.35
-20 5.168
5.261
7.037
9.465
9.761
11.48
11.89
-15 4.191
4.261
5.507
7.147
7.362
8.466
8.727
-10 3.424
3.476
4.344
5.444
5.599
6.300
6.469
-5 2.819
2.856
3.453
4.181
4.291
4.730
4.839
0 2.336
2.362
2.764
3.237
3.312
3.582
3.650
5 1.948
1.966
2.227
2.524
2.574
2.734
2.776
10 1.635
1.646
1.806
1.981
2.013
2.102
2.126
15 1.380
1.386
1.474
1.567
1.584
1.629
1.641
20 1.171
1.174
1.211
1.247
1.255
1.272
1.276
25 1
1
1
1
1
1
1
30 0.8585
0.8565
0.8309
0.8072
0.8016
0.7921
0.7890
35 0.7407
0.7372
0.6941
0.6556
0.6461
0.6315
0.6266
40 0.6422
0.6376
0.5828
0.5356
0.5235
0.5067
0.5007
45 0.5595
0.5541
0.4916
0.4401
0.4266
0.4090
0.4025
50 0.4899
0.4836
0.4165
0.3635
0.3496
0.3319
0.3254
55 0.4309
0.4238
0.3543
0.3018
0.2881
0.2709
0.2645
60 0.3806
0.3730
0.3027
0.2518
0.2386
0.2222
0.2161
65 0.3376
0.3295
0.2595
0.2111
0.1985
0.1832
0.1774
70 0.3008
0.2922
0.2233
0.1777
0.1659
0.1518
0.1465
75 0.2691
0.2600
0.1929
0.1504
0.1393
0.1264
0.1215
80 0.2417
0.2322
0.1672
0.1278
0.1174
0.1057
0.1013
85 0.2180
0.2081
0.1451
0.1090
0.09937
0.08873
0.08486
90 0.1974
0.1871
0.1261
0.09310
0.08442
0.07468
0.07138
95 0.1793
0.1688
0.1097
0.07980
0.07200
0.06307
0.06028
100 0.1636
0.1528
0.09563
0.06871
0.06166
0.05353
0.05112
105 0.1498
0.1387
0.08357
0.05947
0.05306
0.04568
0.04351
110 0.1377
0.1263
0.07317
0.05170
0.04587
0.03918
0.03718
115 0.1270
0.1153
0.06421
0.04512
0.03979
0.03374
0.03188
120 0.1175
0.1056
0.05650
0.03951
0.03460
0.02916
0.02742
125 0.1091
0.09695
0.04986
0.03470
0.03013
0.02527
0.02367
½1
Other than ERTJ0ET104
½2
ERTJ0ET104 only.
in B
25/50
=4500K.
ERTJ T ERTJ0ET104
4500K
4500K
(4450K)
(4580K)
½1
½2
63.30
47.07
42.92
33.31
29.50
23.80
20.53
17.16
14.46
12.49
10.30
9.159
7.407
6.772
5.388
5.046
3.966
3.789
2.953
2.864
2.221
2.179
1.687
1.669
1.293
1.287
1
1
0.7799
0.7823
0.6131
0.6158
0.4856
0.4876
0.3874
0.3884
0.3111
0.3111
0.2513
0.2504
0.2042
0.2026
0.1670
0.1648
0.1377
0.1348
0.1144
0.1108
0.09560
0.09162
0.08033
0.07609
0.06782
0.06345
0.05753
0.05314
0.04903
0.04472
0.04198
0.03784
0.03609
0.03218
0.03117
0.02748
0.02702
0.02352
0.02351
0.02017
ERTJ V
4700K
(4750K)
59.76
41.10
28.61
20.14
14.33
10.31
7.482
5.481
4.050
3.015
2.262
1.710
1.303
1
0.7734
0.6023
0.4721
0.3723
0.2954
0.2356
0.1889
0.1523
0.1236
0.1009
0.08284
0.06834
0.05662
0.04712
0.03939
0.03308
0.02791
0.02364
0.02009
0.01712
kn
(R
25
/R
50
)
B
25/50
=
1/298.15–1/323.15
kn
(R
25
/R
85
)
B
25/85
=
1/298.15–1/358.15
R
25
=Resistance at 25.0±0.1 °C
R
50
=Resistance at 50.0±0.1 °C
R
85
=Resistance at 85.0±0.1 °C
02 Dec. 2008
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC152 –
Multilayer NTC Thermistors
■
Specification and Test Method
Specification
Item
Rated Zero-power Within the specified tolerance.
Resistance (R
25
)
Test Method
The value of the d.c. resistance shall be measured at
the rated ambient temperature of 25.0 ±0.1 °C under
the power less than 0.1mW which is negligible self
heat generation.
The Zero-power resistances; R
1
and R
2
, shall be
measured respectively at T
1
(°C) and T
2
(°C).
The B value is calculated by the following equation.
kn
(R
1
)–kn (R
2
)
B
T
1
/T
2
=
1/(T
1
+273.15)–1/(T
2
+273.15)
B
25/50
B
25/85
Adhesion
T
1
25.0 ±0.1 °C
25.0 ±0.1 °C
T
2
50.0 ±0.1 °C
85.0 ±0.1 °C
B Value
Within the specified tolerance.
½
Individual Specification shall specify B
25/50
or
B
25/85
.
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0201
:2N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
1.0
0.5R
0.3/Size:0201
0.5/Size:0402
Test Sample
Board
Size : 0603
1.0
Test
Sample
Unit : mm
Bending Strength There shall be no cracks and other mechanical
damage.
R
25
change : within ±5 %
Bending distance : 1 mm
Bending speed : 1 mm/s
Bending
distance
Unit : mm
20
R340
45±2
45±2
Resistance to
Soldering Heat
There shall be no cracks and other mechanical
damage.
Nallow Tol. type Standard type
R
25
change
: within ±2 %
within ±3 %
B Value change : within ±1 %
within ±2 %
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period : 3.0 ±0.5 s
Preheat condition :
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Solderability
More than 75 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : H63A (JIS–Z–3282)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Dec. 2008
– EC153 –
Multilayer NTC Thermistors
■
Specification and Test Method
Item
Temperature
Cycling
Specification
Test Method
Nallow Tol. type Standard type Conditions of one cycle
R
25
change
: within ±2 %
within ±3 %
Step 1 : –40 °C, 30±3 min
B Value change : within ±1 %
within ±2 %
Step 2 : Room temp., 3 min max.
Step 3 : 125 °C, 30±3 min.
Step 4 : Room temp., 3 min max.
Number of cycles: 100 cycles
R
25
change
:
B Value change :
R
25
change
:
B Value change :
Cold Resistance
R
25
change
:
B Value change :
Dry Heat
Resistance
R
25
change
:
B Value change :
Nallow Tol. type Standard type Temperature : 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Test period : 1000 +48/0 h
Nallow Tol. type Standard type Temperature : 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Applied power : 10 mW
Test period : 500 +24/0 h
Nallow Tol. type Standard type Temperature : –40 ±3 °C
within ±2 %
within ±3 % Test period : 1000 +48/0 h
within ±1 %
within ±2 %
Nallow Tol. type Standard type Temperature : 125 ±3 °C
within ±2 %
within ±3 % Test period : 1000 +48/0 h
within ±1 %
within ±2 %
Moisture
Resistance
Damp Heat Load
●
0402(EIA)
B value class code
Nominal
Resistance
Resistance
Tolerance Nominal B value B
25/50
at 25 °C
½()
Reference value B
25/85
±1 %(F)
10 k
or
100 k
±2 %(G)
: Resistance Tolerance Code
Avoid flow soldering.
●
0603(EIA)
B value class code
Nominal
Resistance
Resistance
Tolerance Nominal B value B
25/50
at 25 °C
½()
Reference value B
25/85
±1 %(F)
10 k
or
100 k
±2 %(G)
: Resistance Tolerance Code
Avoid flow soldering.
■
Part Number List of Narrow Tolerance Type (Resistance Tolerance : ±2 %, ±1 %)
G
(3375 K)
3435 K±1 %
ERTJ0EG103 A
V
4700 K±1 %
(4750 K)
ERTJ0EV104
G
(3375 K)
3435 K±1 %
ERTJ1VG103 A
S
(4330 K)
4390 K±1 %
ERTJ1VS104 A
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Dec. 2008
– EC154 –
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