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HY5V26CSF-PI

Description
Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8.30 X 10.50 MM, 0.80 MM PITCH, FBGA-54
Categorystorage    storage   
File Size114KB,14 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance
Download Datasheet Parametric View All

HY5V26CSF-PI Overview

Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8.30 X 10.50 MM, 0.80 MM PITCH, FBGA-54

HY5V26CSF-PI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSK Hynix
Parts packaging codeBGA
package instructionFBGA, BGA54,9X9,32
Contacts54
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PBGA-B54
JESD-609 codee1
length10.5 mm
memory density134217728 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA54,9X9,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.07 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.001 A
Maximum slew rate0.2 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width8.3 mm
HY5V26C(L/S)F-I Series
4 Banks x 2M x 16bits Synchronous DRAM
DESCRIPTION
The Hynix HY5V26C(L/S)F is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the Mobile applications which require
low power consumption and industrial temperature range. HY5V26C(L/S)F is organized as 4banks of 2,097,152x16
HY5V26C(L/S)F is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchro-
nized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output
voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated
by a single control command (Burst length of 1,2,4,8, or full page), and the burst count sequence(sequential or interleave). A burst of
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)
FEATURES
Single 3.3±0.3V power supply
All device balls are compatible with LVTTL interface
54Ball FBGA (10.5mm x 8.3mm)
All inputs and outputs referenced to positive edge of
system clock
Data mask function by UDQM or LDQM
Internal four banks operation
Programmable CAS Latency ; 2, 3 Clocks
Auto refresh and self refresh
4096 refresh cycles / 64ms
Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or Full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
ORDERING INFORMATION
Part No.
HY5V26CF-6I
HY5V26CF-KI
HY5V26CF-HI
HY5V26CF-8I
HY5V26CF-PI
HY5V26CF-SI
HY5V26CL(S)F-6I
HY5V26CL(S)F-KI
HY5V26CL(S)F-HI
HY5V26CL(S)F-8I
HY5V26CL(S)F-PI
HY5V26CL(S)F-SI
Clock Frequency
166MHz
133MHz
133MHz
Power
Organization
Interface
Package
Normal
125MHz
100MHz
100MHz
166MHz
133MHz
133MHz
Low power
125MHz
100MHz
100MHz
4Banks x 2Mbits
x16
LVTTL
54ball FBGA
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits de-
scribed. No patent licenses are implied.
Rev. 0.9/Oct. 01
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