Le87270
VDSL2 30a, Class AB Line Driver
Preliminary Data Sheet
FEATURES
•
•
•
•
•
•
VDSL2 30a profile, 14.5 dBm Line Driver
Very low power dissipation
– Class AB operation
Up to 8 programmable states
No external gain resistors required
Small footprint package
– 16-pin (4 mm x 4 mm) QFN
RoHS compliant
Document ID# 146430
Version 6
January 2016
ORDERING INFORMATION
Le87270NQC
Le87270NQCT
16-pin QFN Green Package
16-pin QFN Green Package
Tray
Tape and Reel
The green package meets RoHS 2 Directive 2011/65/EU of the
European Council to minimize the environmental impact of electrical
equipment.
APPLICATIONS
•
•
VDSL2 Line Driver
ADSL2+ CPE Line Driver
The line driver gain is fixed internally. The amplifiers are
powered from a single supply.
Control pins can be used to adjust the supply current to
one-of-three or one-of-seven preset Bias level states and
a Standby state. The control pins respond to input levels
that can be generated with a standard tri-state GPIO.
The Le87270 is available in a 16-pin (4 mm x 4 mm) QFN
package with exposed pad for enhanced thermal
conductivity.
DESCRIPTION
The Le87270 is a single channel differential amplifier
designed to drive full rate VDSL2, as well as ADSL2+
signals with very low power dissipation. The Le87270
contains a pair of wideband amplifiers designed with
Microsemi’s HV15 Bipolar SOI process for low power
consumption.
BLOCK DIAGRAM
C1
C0
CF
VINA
VS
Mode
Control
VS
GND
VS
+
–
A
VOUTA
GND
VS
GND
VINB
–
+
B
VOUTB
GND
Microsemi Semiconductor Inc.
© Copyright 2016, Microsemi Corporation. All Rights Reserved.
Le87270
TABLE OF CONTENTS
Preliminary Data Sheet
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
State Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Line Driver Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16-pin QFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
3
3
4
4
4
4
5
7
8
8
8
9
9
2
Microsemi Semiconductor Inc.
© Copyright 2016, Microsemi Corporation. All Rights Reserved.
Le87270
CONNECTION DIAGRAM
Preliminary Data Sheet
Notes:
1.
2.
Pin 1 is marked for orientation.
The
Le87270
device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected
to a copper plane through thermal vias, for proper heat dissipation. It is electrically isolated and maybe connected to GND.
PIN DESCRIPTIONS
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pin Name
NC
NC
VINA
GND
NC
CF
GND
C0
C1
VINB
NC
NC
VOUTB
VS
NC
VOUTA
Exposed pad
Output
Output
Power
Input
Ground
Input
Input
Input
Input
Ground
Type
No internal connection
Non-inverting input of amplifier A
Reference ground
No internal connection
Digital mode control - Fine Bias steps
Reference ground
Digital mode control 0
Digital mode control 1
Non-inverting input of amplifier B
No internal connection
Amplifier B output
Power supply, +12 V
No internal connection
Amplifier A output
Electrically isolated thermal conduction pad,
can be grounded
Description
3
Microsemi Semiconductor Inc.
© Copyright 2016, Microsemi Corporation. All Rights Reserved.
Le87270
ABSOLUTE MAXIMUM RATINGS
Preliminary Data Sheet
Stresses above the values listed under
Absolute Maximum Ratings
can cause permanent device failure.
Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods
can affect device reliability
.
Storage Temperature
Operating Junction Temperature
(Note 1)
VS with respect to GND
Driver inputs (VINA, VINB)
Control inputs with respect to GND
Continuous Driver Output Current
ESD Immunity (Human Body Model)
ESD Immunity (Charge Device Model)
Note:
1.
Continuous operation above 145°C junction temperature may degrade device reliability.
65
T
A
+150°C
T
A
+150°C
0.3
V to +16 V
GND to VS
0.3
V to 4 V
75 mA
JESD22 Class 2 compliant
JESD22 Class IV compliant
Thermal Resistance
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board
layout. Specified performance requires that the exposed thermal pad be soldered to an equally sized exposed
copper surface, which, in turn, conducts heat through multiple vias to larger internal copper planes.
Package Assembly
The green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and
antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board
assembly processes or newer lead-free board assembly processes.
Refer to IPC/JEDEC J-Std-020 Table 4 for recommended peak soldering temperature and Table 5-2 for the
recommended solder reflow temperature profile.
OPERATING RANGES
Microsemi guarantees the performance of this device over the industrial (-40°C to 85°C) temperature range by
conducting electrical characterization over each range and by conducting a production test with single insertion
coupled with periodic sampling. These characterization and test procedures comply with the Telcordia GR-357-
CORE Generic Requirements for Assuring the Reliability of Components Used in Telecommunications Equipment.
Ambient temperature
Power Supply
T
A
VS with respect to GND
-40°C to +85°C
+12 V ± 5%
4
Microsemi Semiconductor Inc.
© Copyright 2016, Microsemi Corporation. All Rights Reserved.
Le87270
DEVICE SPECIFICATIONS
Preliminary Data Sheet
Typical Conditions:
As shown in the basic test circuit (Figure
1)
with VS = +12 V and T
A
= 25°C.
Min/Max Parameters:
T
A
= -40 to +85°C
Table 1. Electrical Specifications
Symbol
Parameter
Description
High Bias
I
VS
Total Supply Current
Medium Bias
Low Bias
Standby
Control Input (C0, C1, CF) Level Specifications
V
IH
V
IL
I
IH
I
IL
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
C0/1 = 3.3 V
CF = 3.3 V
C0/1 = 0 V
CF = 0 V
VOUT/VIN
10
0
0
10
5.35
9.5
300
Default bias state
Default bias state
Differential, Default bias state
ADSL2, 25
138
kHz
VDSL2 17a US0 band, 25
138
kHz
VDSL2 17a US1 band, 3.75
5.2
MHz
VDSL2 17a US2 band, 8.5
12.0
MHz
VDSL2 30a US1 band, 3.75
5.2
MHz
VDSL2 30a US2 band, 8.5
12.0
MHz
VDSL2 30a US3 band, 22.8
30.0
MHz
Default bias state
200 kHz,
10 MHz
20 MHz
30 MHz
85
80
74
66
65
60
55
-89
-75
-72
-71
80
1100
90
66
0.02
0.1
50
5.50
10
2.0
0.8
100
10.0
10.0
100
5.60
V
V
µA
µA
µA
µA
V/V
V
mA
MHz
V/µs
nV/
Hz
4
4
2
3
Condition
Min
30
23
11
400
Typ
40
33
15
500
Max
50
38
19
650
Unit
mA
mA
mA
µA
1
Notes
Supply Current Characteristics
Amplifier Output Characteristics
Differential Gain
V
O
I
O
BW
SR
Noise
Output Voltage
Output Current
-3 dB Bandwidth
Slew rate
Output Voltage Noise
Amplifier Dynamic Characteristics
MTPR
Multi Tone Power
Ratio
dBc
THD
Total Harmonic
Distortion
dBc
Notes:
1. Bias states as selected from
Table 2.
2.
3.
4.
Current going into the control pins.
Current coming out of the control pins.
Not tested in production. Guaranteed by characterization and design.
5
Microsemi Semiconductor Inc.
© Copyright 2016, Microsemi Corporation. All Rights Reserved.
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