KS259-210GG datasheet, PDF - EEWORLD Datasheet

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KS259-210GG: DescriptionIC Socket, PGA259, 259 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,; CategoryThe connector socket; File Size261KB，2 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

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KS259-210GG Overview

IC Socket, PGA259, 259 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

KS259-210GG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compli
ECCN code	EAR99
Other features	2.5 OZ. AVG. INSERTION FORCE
body width	1.8 inch
subject depth	0.015 inch
body length	1.8 inch
Contact structure	18X18
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrie
Contact material	BE-CU
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	PGA259
Shell material	POLYAMIDE
JESD-609 code	e4
Manufacturer's serial number	KS
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	259
Maximum operating temperature	400 °C
Minimum operating temperature	-269 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER
Base Number Matches	1

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PGA Sockets

Table of Models

Low Insertion Force PGA Sockets

.100/(2.54mm) Standard Grid

Description:

Peel-A-Way

(KIS)

Material: Polyimide Film

Index: -269°C to 400°C (-452°F to 752°F)

Description:

FR-4 (FIS)

Material: FR-4 Fiberglass Epoxy Board

Index: -40°C to 140°C (-40°F to 284°F)

Features:

• Low insertion force (1 oz. average

per pin).

• Screw-machined terminals with

multiple finger contacts for

reliability.

• Closed bottom terminal for 100%

anti-wicking of solder.

• Tapered entry for ease of

insertion.

• Custom designs available.

Description:

Molded (RIS)

Mat’l: High Temp. Liquid Crystal Polymer (LCP)

Index: -40°C to 260°C (-40°F to 500°F)

RIS replaces HCIS, HCS, CIS, and CS.

.005

(.13)

PC Board

Polyimide

Film

.062

(1.57)

.095

(2.41)

Options

Tape Seal - add 3M to end of part number

• Removable tape seal protects plated contact in harsh environments

• Sealed socket will not allow dirt and other contaminants to enter

socket chamber and become entrapped behind contact fingers

• Spray flux without contaminating contact area

Specifications:

Terminals:

Brass - Copper Alloy

(C36000) ASTM-B-16

Contacts:

Beryllium Copper

(C17200) ASTM-B-194

Solder Preform:

Standard: 63Sn/37Pb

Lead-free: 95.5Sn/4.0Ag/0.5Cu

Plating:

G - Gold over Nickel

M - Matte Tin over Nickel

T - Tin/Lead over Nickel

Gold per ASTM-B-488

Matte Tin per ASTM545-97

Tin/Lead per MIL-P-81728

Nickel per QQ-N-290

Material

Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)

Intermittent to 371°C (700°F)

How To Order

1 RIS

Footprint Dash #

If Applicable

Body Type

RoHS Compliant Insulators:

KIS - Peel-A-Way

068 - 04 M G

Contact Plating

RoHS Compliant:

G - Gold

T - Tin/Lead

Terminal Plating

RoHS Compliant:

FIS - FR-4

RIS - Hi-Temp Molded LCP

Number of Pins

004 to 484

*Footprints available online

G - Gold

M - Matte Tin

T - Tin/Lead

Terminal Type

See options on next page

Note: Terminals plated with Matte Tin are available only with Gold plated contacts.

Quick-Turn delivery is not available on products with Matte Tin plating.

5 Energy Way, West Warwick, RI 02893 USA

Tel: 800.424.9850 | 401.823.5200

Fax: 401.823.8723

info@advanced.com | www.advanced.com

Catalog 16

rev. Sept. 07

1 ESX 503 - 234

Footprint Dash #

Body Type

RoHS Compliant:

Contact Plating

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

If Applicable

inch/(mm)

G - Gold

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