LS SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Maker | Motorola ( NXP ) |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | LS |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| length | 19.495 mm |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 7 mA |
| propagation delay (tpd) | 27 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| SN74LS13JD | SN54LS13JD | SN54LS14JD | SN74LS14J | SN74LS13ND | SN74LS14ND | |
|---|---|---|---|---|---|---|
| Description | LS SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | LS SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | LS SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 | LS SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 | LS SERIES, DUAL 4-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 | LS SERIES, HEX 1-INPUT INVERT GATE, PDIP14, PLASTIC, DIP-14 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP14,.3 | DIP, | DIP, | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| series | LS | LS | LS | LS | LS | LS |
| JESD-30 code | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
| length | 19.495 mm | 19.495 mm | 19.495 mm | 19.495 mm | 18.86 mm | 18.86 mm |
| Load capacitance (CL) | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | INVERTER | INVERTER | NAND GATE | INVERTER |
| Number of functions | 2 | 2 | 6 | 6 | 2 | 6 |
| Number of entries | 4 | 4 | 1 | 1 | 4 | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Maximum supply current (ICC) | 7 mA | 7 mA | 21 mA | 21 mA | 7 mA | 21 mA |
| propagation delay (tpd) | 27 ns | 27 ns | 22 ns | 22 ns | 27 ns | 22 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 4.69 mm | 4.69 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Maker | Motorola ( NXP ) | - | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 |
| Encapsulate equivalent code | DIP14,.3 | - | - | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | - | - | 5 V | 5 V | 5 V |
| Schmitt trigger | YES | - | - | YES | YES | YES |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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