Freescale Semiconductor, Inc.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Document order number: MC33661
Rev 3.0, 10/2004
Advance Information
LIN Enhanced Physical Interface
Local Interconnect Network (LIN) is a serial communication protocol
designed to support automotive networks in conjunction with Controller Area
Network (CAN). As the lowest level of a hierarchical network, LIN enables
cost-effective communication with sensors and actuators when all the features
of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN sub-
bus applications. It offers slew rate selection for optimized operation at
10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and
programming modes, excellent radiated emission performance, and safe
behavior in the event of LIN bus short-to-ground or LIN bus leakage during
low-power mode.
Features
• Operational from V
SUP
6.0 V to 18 V DC, Functional up to 27 V DC, and
Handles 40 V During Load Dump
• Active Bus Waveshaping Offering Excellent Radiated Emission
Performance
• 5.0 kV ESD on LIN Bus Terminal
• 30 kΩ Internal Pullup Resistor
• LIN Bus Short-to-Ground or High Leakage in Sleep Mode
• -18 V to +40 V DC Voltage at LIN Terminal
• 8.0
µA
Standby Current in Sleep Mode
• Local and Remote Wake-Up Capability Reported by INH and RXD
Terminals
• 5.0 V and 3.3 V Compatible Digital Inputs Without Any External
Components Required
33661
LIN INTERFACE
Freescale Semiconductor, Inc...
D SUFFIX
CASE 751-06
8-TERMINAL SOICN
ORDERING INFORMATION
Device
MC33661D/R2
Temperature
Range (T
A
)
-40°C to 125°C
Package
8 SOICN
33661 Simplified Application Diagram
V
PWR
33661
WAKE
V
SUP
INH
12.0 V / 5.0 V
Regulator
EN
MCU
RXD
TXD
LIN
GND
LIN Bus
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Motorola, Inc. 2004
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V
SUP
WAKE
EN
INH
Control
20
µA
INH
Control
RXD
30 kΩ
Receiver
LIN
Freescale Semiconductor, Inc...
TXD
Slope
Control
GND
Figure 1. 33661 Simplified Internal Block Diagram
33661
2
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
Freescale Semiconductor, Inc.
RXD
EN
WAKE
TXD
1
2
3
4
8
7
6
5
INH
V
SUP
LIN
GND
TERMINAL DEFINITIONS
A functional description of each terminal can be found in the System/Application Information section beginning on
page 13.
Terminal
1
Terminal
Name
RXD
EN
WAKE
TXD
INH
V
SUP
LIN
GND
Formal Name
Receiver Output
Enable Control
Wake Input
Transmitter Input
Inhibit Output
Power Supply
LIN Bus
Ground
Definition
MCU interface that reports the state of the LIN bus voltage.
Controls the operation mode of the interface.
A high-voltage input used to wake up the device from sleep mode.
MCU interface to control the state of the LIN output.
This terminal can have two main functions: controlling an external switchable voltage
regulator or driving a bus external resistor in the master node application.
Device power supply terminal.
Represents the single-wire bus transmitter and receiver.
Device ground terminal.
Freescale Semiconductor, Inc...
2
3
4
5
6
7
8
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
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33661
3
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MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Continuous Supply Voltage
Transient Voltage (Load Dump)
WAKE DC and Transient Voltage (Through a 33 kΩ Serial Resistor)
Logic Terminals (RXD, TXD, EN)
LIN
V
WAKE
V
LOG
V
BUS
-18 to 40
-150 to 100
V
INH
I
INH
V
ESD1
±2000
±5000
V
ESD2
±200
V
-0.3 to V
SUP
+ 0.3
40
V
mA
V
V
SUP
27
40
-18 to 40
-0.3 to 5.5
V
V
V
V
Freescale Semiconductor, Inc...
DC Voltage
Transient (Coupled Through 1.0 nF Capacitor)
INH
DC Voltage
DC Current
ESD Human Body Model
(Note 1)
All Terminals
LIN Terminal with Respect to Ground
ESD Machine Model
(Note 2)
All Terminals
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Storage Temperature
Thermal Resistance Junction to Ambient
Peak Package Reflow Temperature During Solder Mounting
(Note 3)
Thermal Shutdown
Thermal Shutdown Hysteresis
T
A
T
J
T
S
R
θ
JA
T
SOLDER
T
SHUT
T
HYST
-40 to 125
-40 to 150
-40 to 150
150
240
150 to 200
8.0 to 20
°C
°C/W
°C
°C
°C
°C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω).
2.
3.
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 220 pF, R
ZAP
= 0
Ω).
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
Freescale Semiconductor, Inc.
STATIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions 7.0 V
≤
V
SUP
≤
18 V, -40°C
≤
T
A
≤
125°C, GND = 0 V unless otherwise noted. Typical values
noted reflect the approximate parameter means at T
A
= 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
V
SUP
TERMINAL (DEVICE POWER SUPPLY)
Nominal DC Voltage
Functional DC Voltage
T
A
≥
25°C
Supply Current in Sleep Mode
V
SUP
≤
13.5 V, Bus Recessive
13.5 V < V
SUP
< 18 V
I
S1
I
S2
I
S3
–
–
–
8.0
–
300
12
200
–
mA
I
S(N-REC)
I
S(N-DOM)
–
–
4.0
6.0
6.0
8.0
V
SUP
V
SUP
6.0
–
–
µA
7.0
13.5
18.0
V
V
Freescale Semiconductor, Inc...
V
SUP
≤
13.5 V, Bus Dominant or Shorted to GND
Supply Current in Normal, Slow or Fast Mode
Bus Recessive, Excluding INH Output Current
Bus Dominant, Total Bus Load >500
Ω,
Excluding INH Output Current
RXD OUTPUT TERMINAL (LOGIC)
Low-Level Voltage Output
I
IN
≤
1.5 mA
High-Level Voltage Output
V
EN
= 5.0 V, I
OUT
≤
250
µA
V
EN
= 3.3 V, I
OUT
≤
250
µA
V
OH
4.25
3.0
–
–
5.25
3.5
V
OL
0
–
0.9
V
V
TXD INPUT TERMINAL (LOGIC)
Low-Level Voltage Input
High-Level Voltage Input
Input Threshold Hysteresis
Pullup Current Source
V
EN
= 5.0 V, 1.0 V < V
TXD
< 3.5 V
V
IL
V
IH
V
INHYST
I
S1
-60
-35
-20
–
2.5
100
–
–
300
1.2
–
800
V
V
mV
µA
ENABLE INPUT TERMINAL (LOGIC)
Low-Level Voltage Input
High-Level Voltage Input
Input Threshold Hysteresis
Low-Level Input Current
V
IN
= 1.0 V
High-Level Input Current
V
IN
= 4.0 V
I
IH
–
20
40
V
IL
V
IH
V
INHYST
I
IL
5.0
20
30
µA
–
2.5
100
–
–
300
1.2
–
800
V
V
mV
µA
LIN BUS TERMINAL (VOLTAGE EXPRESSED VERSUS V
SUP
VOLTAGE)
Low-Level Dominant Voltage
External Bus Pullup 500
Ω
High-Level Voltage
TXD High, I
OUT
= 1.0
µA,
Recessive State
V
LIN
high
V
SUP
- 1.0
–
–
V
LIN
low
–
–
1.4
V
V
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
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33661
5
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