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24LC64TI-/ST

Description
8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
Categorystorage    storage   
File Size721KB,36 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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24LC64TI-/ST Overview

8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

24LC64TI-/ST Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instruction4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
Contacts8
Reach Compliance Codecompli
Maximum clock frequency (fCLK)0.4 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density65536 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count8192 words
character code8000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
Base Number Matches1
24AA64/24LC64/24FC64
64K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA64
24LC64
24FC64
Note 1:
2:
V
CC
Range
1.7-5.5
2.5-5.5
1.7-5.5
Max. Clock
Frequency
400 kHz
(1)
400 kHz
1 MHz
(2)
Temp.
Ranges
I
I, E
I
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24AA64/24LC64/
24FC64 (24XX64*) is a 64 Kbit Electrically Erasable
PROM. The device is organized as a single block of 8K
x 8-bit memory with a 2-wire serial interface. Low-volt-
age design permits operation down to 1.7V, with
standby and active currents of only 1
μA
and 1 mA,
respectively. It has been developed for advanced, low-
power applications such as personal communications
or data acquisition. The 24XX64 also has a page write
capability for up to 32 bytes of data. Functional address
lines allow up to eight devices on the same bus, for up
to 512 Kbits address space. The 24XX64 is available in
the standard 8-pin PDIP, surface mount SOIC, TSSOP,
DFN, TDFN and MSOP packages. The 24XX64 is also
available in the 5-lead SOT-23, and Chip Scale
packages.
100 kHz for V
CC
<2.5V
400 kHz for V
CC
<2.5V
Features:
• Single-Supply with Operation down to 1.7V for
24AA64/24FC64 devices, 2.5V for 24LC64
devices
• Low-Power CMOS Technology:
- Active current 1 mA, typical
- Standby current 1
μA,
typical
• 2-Wire Serial Interface, I
2
C™ Compatible
• Cascadable up to 8 Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• 1 MHz Clock for FC versions
• Page Write Time 5 ms, typical
• Self-timed Erase/Write Cycle
• 32-Byte Page Write Buffer
• Hardware Write-protect
• ESD Protection > 4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention > 200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
MSOP, DFN, TDFN, 5-lead SOT-23 or Chip Scale
• Pb-Free and RoHS Compliant
Block Diagram
A0 A1 A2 WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SCL
YDEC
SDA
V
CC
V
SS
Sense Amp.
R/W Control
Package Types
PDIP/MSOP/SOIC/TSSOP
A0
A1
A2
V
SS
Note
1
2
3
4
1:
8
7
6
5
V
CC
WP
SCL
SDA
SCL
V
SS
SDA
1
2
3
4
V
CC
SOT-23
5
WP
A0 1
A1 2
A2 3
V
SS
4
DFN/TDFN
8 V
CC
7 WP
6 SCL
5 SDA
CS (Chip Scale)
(1)
V
CC
WP
SCL
1
3
4
5
SDA
2
V
SS
(Top Down View,
Balls Not Visible)
Available in I-temp, “AA” only.
* 24XX64 is used in this document as a generic part number for the 24AA64/24LC64/24FC64 devices.
©
2009 Microchip Technology Inc.
DS21189P-page 1

24LC64TI-/ST Related Products

24LC64TI-/ST 24LC64TI-/SN 24AA64TI-/SM 24AA64TI-/SN 24AA64TI-/ST 24LC64TI-/SM
Description 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC
package instruction 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 SOP, SOP, SOP, TSSOP, SOP,
Contacts 8 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli compli
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 e3
length 4.4 mm 4.9 mm 5.245 mm 4.9 mm 4.4 mm 5.245 mm
memory density 65536 bi 65536 bi 65536 bi 65536 bi 65536 bi 65536 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP SOP SOP TSSOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.75 mm 2.03 mm 1.75 mm 1.2 mm 2.03 mm
Serial bus type I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V 1.7 V 1.7 V 1.7 V 2.5 V
Nominal supply voltage (Vsup) 5 V 5 V 2.5 V 2.5 V 2.5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40
width 3 mm 3.9 mm 5.23 mm 3.9 mm 3 mm 5.23 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Base Number Matches 1 1 1 1 1 1
Humidity sensitivity level 1 1 - 1 1 -

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