v2.0
Automotive ProASIC
®
3 Flash Family FPGAs
with Grade 2 and Grade 1 AEC-Q100 Support
Features and Benefits
High-Temperature AEC-Q100–Qualified Devices
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Grade 2 105°C T
A
(115°C T
J
)
Grade 1 125°C T
A
(135°C T
J
)
PPAP Documentation
Only Automotive FPGAs to Offer Firm-Error Immunity
Can Be Used Without Configuration Upset Risk
60 k to 1 Million System Gates
Up to 144 kbits of SRAM
Up to 300 User I/Os
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Automotive Process
Live-at-Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design When Powered Off
1 kbit of FlashROM with Synchronous Interface
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–
compliant)
FlashLock
®
to Secure FPGA Contents (anti-tampering)
®
Low Power
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.5 V Core Voltage
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
Segmented, Hierarchical Routing and Clock Structure
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—Up to 4 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, BLVDS, and
M-LVDS (A3P250 and A3P1000)
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold-Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages Across the Automotive
ProASIC3 Family
Six CCC Blocks, One with an Integrated PLL
Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
Wide Input Frequency Range (1.5 MHz up to 350 MHz)
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2,
×4, ×9, and ×18 Organizations Available)
High-Performance Routing Hierarchy
Firm-Error Immune
High Capacity
Advanced I/O
Reprogrammable Flash Technology
On-Chip User Nonvolatile Memory
High Performance
In-System Programming (ISP) and Security
Clock Conditioning Circuit (CCC) and PLL
•
•
•
•
SRAMs
Table 1 •
Automotive ProASIC3 Product Family
A3P060
60 k
1,536
18
4
1k
Yes
1
18
2
96
VQ100
FG144
ProASIC3 Devices
System Gates
VersaTiles (D-flip-flops)
RAM kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Bits
Secure (AES) ISP
Integrated PLL in CCCs
VersaNet Globals*
I/O Banks
Maximum User I/Os
Package Pins
VQFP
FBGA
A3P125
125 k
3,072
36
8
1k
Yes
1
18
2
133
VQ100
FG144
A3P250
250 k
6,144
36
8
1k
Yes
1
18
4
157
VQ100
FG144, FG256
A3P1000
1M
24,576
144
32
1k
Yes
1
18
4
300
FG144, FG256, FG484
Note:
*Six chip-wide (main) globals and three additional global networks in each quadrant are available.
August 2007
© 2007 Actel Corporation
i
See the Actel website for the latest version of the datasheet.
Automotive ProASIC3 Flash Family FPGAs
I/Os Per Package
ProASIC3 Devices
A3P060
A3P125
A3P250
I/O Type
Differential I/O Pairs
Differential I/O Pairs
–
25
44
74
Single-Ended I/O
2
2
A3P1000
Single-Ended I/O
Single-Ended I/O
Package
VQ100
FG144
FG256
3
FG484
3
Notes:
71
96
–
–
71
97
–
–
68
97
157
–
13
24
38
–
97
177
300
1. When considering migrating your design to a lower- or higher-density device, refer to
"Package Pin Assignments"
starting on
page
4-1
to ensure complying with design and board migration requirements.
2. Each used differential I/O pair reduces the number of available single-ended I/Os by two.
3. FG256 and FG484 are footprint-compatible packages.
Automotive ProASIC3 Ordering Information
A3P1000
_
1
FG
G
144
T
Application (Temperature Range)
T = Grade 2 and Grade 1 AECQ100
Grade 2 = 105°C T
A
and 115°C T
J
Grade 1 = 125°C T
A
and 135°C T
J
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS-Compliant (Green) Packaging
Package Type
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
Part Number
Automotive ProASIC3 Devices
A3P060 = 60,000 System Gates
A3P125 = 125,000 System Gates
A3P250 = 250,000 System Gates
A3P1000 = 1,000,000 System Gates
Note:
Minimum order quantities apply. Contact your local Actel sales office for details.
ii
v2.0
Single-Ended I/O
–
Automotive ProASIC3 Flash Family FPGAs
Temperature Grade Offerings
Package
VQ100
FG144
FG256
FG484
Notes:
1. C = Commercial temperature range: 0°C to 70°C
2. I = Industrial temperature range: –40°C to 85°C
3. T = Automotive temperature range: Grade 2 and Grade 1 AEC-Q100
Grade 2 = 105°C T
A
and 115°C T
J
Grade 1 = 125°C T
A
and 135°C T
J
4. Specifications for Commercial and Industrial grade devices can be found in the
ProASIC3 Flash Family FPGAs
datasheet.
A3P060
C, I, T
C, I, T
–
–
A3P125
C, I, T
C, I, T
–
–
A3P250
C, I, T
C, I, T
C, I, T
–
A3P1000
–
C, I, T
C, I, T
C, I, T
Speed Grade and Temperature Grade Matrix
Temperature Grade
T (Grade 1 and Grade 2), Commercial, Industrial
Notes:
1. T = Automotive temperature range: Grade 2 and Grade 1 AEC-Q100
Grade 2 = 105°C T
A
and 115°C T
J
Grade 1 = 125°C T
A
and 135°C T
J
2. Specifications for Commercial and Industrial grade devices can be found in the
ProASIC3 Flash Family FPGAs
datasheet.
Std.
✓
–1
✓
Contact your local Actel representative for device availability (http://www.actel.com/contact/default.aspx).
v2.0
iii
Automotive ProASIC3 Flash Family FPGAs
Table of Contents
Introduction and Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Device Architecture
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48
Software Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50
Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-51
ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-51
DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-70
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-76
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-81
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-96
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-97
Package Pin Assignments
100-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
Datasheet Information
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Export Administration Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
v2.1
v
Talking
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