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M39P0R8070E2ZADE

Description
Memory Circuit, Flash+SDRAM, PBGA105
Categorystorage    storage   
File Size478KB,24 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
Download Datasheet Parametric Compare View All

M39P0R8070E2ZADE Overview

Memory Circuit, Flash+SDRAM, PBGA105

M39P0R8070E2ZADE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicron Technology
package instructionFBGA, BGA105,9X12,32
Reach Compliance Codecompliant
Maximum access time96 ns
JESD-30 codeR-PBGA-B105
Memory IC TypeMEMORY CIRCUIT
Mixed memory typesFLASH+SDRAM
Number of terminals105
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA105,9X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
power supply1.8 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
M39P0R8070E2
M39P0R9070E2
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory
128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
Feature summary
Multi-Chip Package
– 1 die of 256 (16Mb x 16) or 512 Mbit (32Mb
x 16, Multiple Bank, Multi-Level, Burst)
Flash memory
– 1 die of 128 Mbit (4 Banks of 2Mb x16)
Low
Power Synchronous Dynamic RAM
Supply voltage
– V
DDF
= V
DDS
= V
DDQ
= 1.7 to 1.95V
– V
PPF
= 9V for fast program
Electronic signature
– Manufacturer Code: 20h
– 256 Mbit Device Code: 8818
– 512 Mbit Device Code: 8819
Package
– ECOPACK® (RoHS compliant)
Synchronous / Asynchronous Read
– Synchronous Burst Read mode:
108MHz, 66MHz
– Asynchronous Page Read mode
– Random Access: 96ns
Programming time
– 4.2µs typical Word program time using
Buffer Enhanced Factory Program
command
Memory organization
– Multiple Bank memory array: 32 Mbit
Banks (256Mb devices); 64 Mbit Banks
(512Mb devices)
– Four Extended Flash Array (EFA) Blocks of
64 Kbits
Dual operations
– program/erase in one Bank while read in
others
– No delay between read and write
operations
FBGA
TFBGA105 (ZAD)
9 x 11mm
100,000 program/erase cycles per block
Security
– 64-bit unique device number
– 2112-bit user programmable OTP Cells
Block locking
– All Blocks locked at power-up
– Any combination of Blocks can be locked
with zero latency
– WP
F
for Block Lock-Down
– Absolute Write Protection with V
PPF
= V
SS
Common Flash Interface (CFI)
128 Mbit Synchronous Dynamic RAM
– Organized as 4 Banks of 2 MWords, each
16 bits wide
Synchronous Burst Read and Write
– Fixed burst lengths: 1, 2, 4, 8 Words or Full
Page
– Burst Types: Sequential and Interleaved
– Maximum Clock frequency: 104MHz
Automatic and controlled Precharge
Low power features:
– Partial Array Self Refresh (PASR)
– Automatic Temperature Compensated Self
Refresh (TCSR)
– Driver Strength (DS)
– Deep Power-Down Mode
Auto Refresh and Self Refresh
Flash memory
LPSDRAM
November 2007
Rev 2
1/24
www.numonyx.com
1

M39P0R8070E2ZADE Related Products

M39P0R8070E2ZADE M39P0R8070E2ZADF
Description Memory Circuit, Flash+SDRAM, PBGA105 Memory Circuit, Flash+SDRAM, PBGA105
Is it Rohs certified? conform to conform to
Maker Micron Technology Micron Technology
package instruction FBGA, BGA105,9X12,32 FBGA, BGA105,9X12,32
Reach Compliance Code compliant compliant
Maximum access time 96 ns 96 ns
JESD-30 code R-PBGA-B105 R-PBGA-B105
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Mixed memory types FLASH+SDRAM FLASH+SDRAM
Number of terminals 105 105
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA
Encapsulate equivalent code BGA105,9X12,32 BGA105,9X12,32
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
power supply 1.8 V 1.8 V
Certification status Not Qualified Not Qualified
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
Temperature level OTHER OTHER
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM

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