M1A3P250-2VQ100VQ100 datasheet, PDF

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M1A3P250-2VQ100VQ100: DescriptionFPGA, 250000 GATES, PQFP100, 0.50 MM PITCH, VQFP-100; CategoryProgrammable logic devices Programmable logic; File Size20MB，608 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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M1A3P250-2VQ100VQ100 Overview

FPGA, 250000 GATES, PQFP100, 0.50 MM PITCH, VQFP-100

M1A3P250-2VQ100VQ100 Parametric

Parameter Name	Attribute value
Objectid	1822049887
package instruction	TFQFP,
Reach Compliance Code	unknown
JESD-30 code	S-PQFP-G100
length	14 mm
Equivalent number of gates	250000
Number of terminals	100
Maximum operating temperature	70 °C
Minimum operating temperature
organize	250000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	14 mm

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ProASIC

3 Handbook

ProASIC3 Handbook

Table of Contents

Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i

Section I – ProASIC3 Datasheet

ProASIC3 Flash Family FPGAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I

ProASIC3 Device Family Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

ProASIC3 DC and Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1

Package Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

Section II – Core Architecture

Low-Power Flash Technology and Flash*Freeze Mode

Core Architecture of IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

Low-Power Modes in Actel ProASIC3/E FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1

Global Resources and Clock Conditioning

Global Resources in Actel Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

Clock Conditioning Circuits in IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

Embedded Memories

FlashROM in Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

SRAM and FIFO Memories in Actel's Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

I/O Descriptions and Usage

I/O Structures in IGLOO and ProASIC3 Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1

I/O Software Control in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1

DDR for Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1

Packaging and Pin Descriptions

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-1

Design Migration

Migrating Designs in ProASIC3 Devices from Higher-Density to Mid-Density Devices . . . . . . . . . . .12-1

Migrating Designs from A3P250 to Lower-Logic-Density Devices . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1

Low-Power Flash Device Handbooks Introduction

Device Handbooks contain all the information available to help designers understand and use

Actel's devices. Handbook chapters are grouped into sections on the website to simplify

navigation. Each chapter of the handbook can be viewed as an individual PDF file.

At the top of the handbook web page, you will see a zip file for each product family. This file

contains the complete device handbook. Please register for product updates to be notified when a

section of the handbook changes.

Versions

Device handbook chapters may have different version numbers. Actel’s goal is to provide customers

with the latest information in a timely matter. As a result, the handbook chapters will be updated

independently of the handbook.

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