DM74S181N/B+ datasheet, PDF - EEWORLD Datasheet

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DM74S181N/B+: DescriptionIC,FIXED POINT ALU,S-TTL,DIP,24PIN,PLASTIC; Categorylogic logic; File Size563KB，10 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S181N/B+ Overview

IC,FIXED POINT ALU,S-TTL,DIP,24PIN,PLASTIC

DM74S181N/B+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
Logic integrated circuit type	ARITHMETIC LOGIC UNIT
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

DM74S181N/B+ Related Products

	DM74S181N/B+	DM54S181J/883C	DM54S181J/883B	DM74S181J/A+	DM74S181N/A+
Description	IC,FIXED POINT ALU,S-TTL,DIP,24PIN,PLASTIC	IC,FIXED POINT ALU,S-TTL,DIP,24PIN,CERAMIC	IC,FIXED POINT ALU,S-TTL,DIP,24PIN,CERAMIC	IC,FIXED POINT ALU,S-TTL,DIP,24PIN,CERAMIC	IC,FIXED POINT ALU,S-TTL,DIP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT
Number of terminals	24	24	24	24	24
Maximum operating temperature	70 °C	125 °C	125 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-

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