IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 30 ns |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| memory density | 1024 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum slew rate | 0.13 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
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