DM74S287J/B+ datasheet, PDF - EEWORLD Datasheet

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DM74S287J/B+: DescriptionIC,PROM,256X4,TTL,DIP,16PIN,CERAMIC; Categorystorage storage; File Size219KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S287J/B+ Overview

IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC

DM74S287J/B+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	50 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
memory density	1024 bit
Memory IC Type	OTP ROM
memory width	4
Number of terminals	16
word count	256 words
character code	256
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.13 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

DM74S287J/B+ Related Products

	DM74S287J/B+	DM74S287N/A+	DM74S287AJ/A+	DM74S287AJ/B+	DM74S287AN/A+	DM74S287J/A+
Description	IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC	IC,PROM,256X4,TTL,DIP,16PIN,PLASTIC	IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC	IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC	DM74S287AN/A+	IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	50 ns	50 ns	30 ns	30 ns	30 ns	50 ns
JESD-30 code	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4
Number of terminals	16	16	16	16	16	16
word count	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256X4	256X4	256X4	256X4	256X4	256X4
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Maximum slew rate	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments

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