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LSI402ZX

Description
Digital Signal Processor, 16-Bit Size, 32-Ext Bit, 40MHz, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, MINI, BGA-208
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size54KB,2 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
Download Datasheet Parametric View All

LSI402ZX Overview

Digital Signal Processor, 16-Bit Size, 32-Ext Bit, 40MHz, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, MINI, BGA-208

LSI402ZX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLSC/CSI
Parts packaging codeBGA
package instructionBGA, BGA208,16X16,40
Contacts208
Reach Compliance Codecompliant
ECCN code3A991.A.2
Other featuresTWO IDENTICAL 16-BIT ALUS OR A SINGLE 32-BIT ALU
Address bus width18
barrel shifterNO
bit size16
boundary scanYES
maximum clock frequency40 MHz
External data bus width32
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B208
JESD-609 codee0
length17 mm
low power modeYES
Number of terminals208
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA208,16X16,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)240
power supply1.8,3.3 V
Certification statusNot Qualified
RAM (number of words)63488
Maximum seat height1.75 mm
Maximum supply voltage1.95 V
Minimum supply voltage1.65 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
LSI402ZX Digital Signal Processor
ZSP Architecture Performance with High-End Integration
Overview
The LSI402ZX is a high-performance 16-bit fixed-point digital signal processor
(DSP) based on the ZSP
TM
Architecture. This device has been designed for
applications that require high data throughput capability coupled with high-speed
I/O, such as communications infrastructure equipment, and offers enhanced I/O
capabilities and large on-chip memory. The LSI402ZX is capable of a maximum
clock rate of 200 MHz for 800 MIPS peak performance and sustained effective
throughput of 400 MMACs.
Memory
The internal memory structure of the LSI402ZX comprises 62K words of data
RAM, 62K words of instruction RAM, 2K words of boot ROM, and 2K words of
data space dedicated to memory-mapped registers and external peripherals. The
boot ROM contains several routines, including internal self-test, and boot-loader
routines. The Memory Interface Unit (MIU) provides a glueless interface to
industry-standard 32-bit synchronous-burst SRAMs (SBSRAMs), and 16-bit
asynchronous SRAMs and ROM devices. The total address range of the MIU is
20 bits, organized as sixteen 64K word pages which are selected by a software-
controlled page register.
Interrupts
Features
200 MHz operation at 1.8 V (5 ns cycle time)
Two high-speed serial/TDM ports (T1/E1
framer, H.100/H.110 bit stream compatible)
Low power dissipation (800 mW at
200 MHz)
62K words data RAM
62K words instruction RAM
2K words ROM
Eight-channel DMA support
On-board PLL for clock generation
32-/16-bit external memory interface
Two on-board timers
16-bit host processor interface
IEEE 1149.1-compliant JTAG port for real-
time emulation and system download
Benefits
400 MMAC sustained DSP performance at
Register
File
Pipeline
Control
Unit
Boot ROM
I Cache
Program RAM
Instruction
Unit
ALU
ALU
Data RAM
D Cache
Memory-Mapped
Registers
Data Unit
Timer 0
Timer 1
MAC
MAC
MIU/DMA
TDM Serial
Port 0
TDM Serial
Port 1
HPI
DEU
JTAG
200 MHz
Direct interfacing to standard
telecommmunication interfaces, reducing
system cost
Low power per channel
Low or zero system memory cost
High data throughput without processor
overhead
Flexibility to optimize power consumption
High data bandwidth to off-chip devices
RTOS support and increased system
integration
Simple interfacing to industry-standard
micros
Low overhead on chip debug
Very high processing density per unit
area
Functional Block Diagram

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